18243835. PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD USING THE SAME
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PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18243835 titled 'PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD USING THE SAME
Simplified Explanation: The patent application describes a pattern inspection apparatus that uses an electron gun to generate an input electron beam, which is then emitted onto a wafer and a sample with holes of varying thicknesses. A detector captures emitted electrons to create a scanning electron microscope (SEM) image, which is processed by a processor to create a three-dimensional profiling image with depth information of the wafer. The processor also determines changes in the input electron beam's condition based on the SEM image analysis.
- Key Features and Innovation:
- Utilizes an electron gun to generate an input electron beam for inspection. - Samples with holes of different thicknesses are used for testing. - Detector captures emitted electrons to create SEM images. - Processor processes SEM images to create three-dimensional profiling images with depth information. - Can determine changes in the input electron beam's condition.
Potential Applications: The technology can be applied in semiconductor manufacturing, quality control processes, and material science research for precise pattern inspection and analysis.
Problems Solved: - Enables detailed inspection of samples with holes of varying thicknesses. - Provides accurate depth information for analysis. - Helps in detecting changes in the input electron beam's condition.
Benefits: - Improved accuracy in pattern inspection. - Enhanced depth information for better analysis. - Efficient detection of changes in the input electron beam's condition.
Commercial Applications: Title: Advanced Pattern Inspection Apparatus for Semiconductor Manufacturing This technology can be utilized in semiconductor fabrication facilities for quality control, research institutions for material analysis, and other industries requiring precise pattern inspection.
Prior Art: There may be prior art related to electron beam inspection systems, scanning electron microscopes, and pattern inspection methods in semiconductor manufacturing.
Frequently Updated Research: Researchers are constantly improving electron beam technologies for more accurate and efficient pattern inspection in various industries.
Questions about Pattern Inspection Technology: 1. How does the pattern inspection apparatus determine changes in the input electron beam's condition? 2. What are the potential limitations of using samples with holes of different thicknesses for inspection?
Original Abstract Submitted
A pattern inspection apparatus includes a sample including a plurality of holes having thicknesses that are different from each other, an electron gun configured to generate an input electron beam and emit the input electron beam onto a wafer and the sample, a stage configured to support the wafer and the sample, a detector configured to generate a scanning electron microscope (SEM) image by detecting emitted electrons from the wafer and the sample, and a processor configured to process the SEM image into a three-dimensional profiling image containing depth information of the wafer and determine whether a condition of the input electron beam has changed based on the processing of the SEM image.
