18243664. THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract (MICRON TECHNOLOGY, INC.)
Contents
THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY
Organization Name
Inventor(s)
Andrew M. Bayless of Boise ID (US)
Brandon P. Wirz of Boise ID (US)
THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18243664 titled 'THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY
Simplified Explanation
Methods and apparatuses for releasing thinned semiconductor dies from a mount tape are disclosed in this patent application. Here is a simplified explanation of the abstract:
- A sacrificial layer is placed on the back side of a thinned substrate containing semiconductor dies.
- The sacrificial layer is made of materials that can dissolve when in contact with a fluid or vapor.
- A perforated mount tape is attached to the sacrificial layer.
- An ejection component is positioned under a specific semiconductor die that needs to be released.
- The ejection component creates a confined puddle of fluid under the target semiconductor die, causing the sacrificial layer to dissolve and release the die from the mount tape.
- A support component is provided to pick up the released semiconductor die.
Potential applications of this technology:
- Semiconductor manufacturing industry
- Electronics assembly and packaging industry
Problems solved by this technology:
- Facilitates the release of thinned semiconductor dies from a mount tape without causing damage or contamination.
- Provides a controlled and localized method for releasing specific semiconductor dies.
Benefits of this technology:
- Enables efficient and precise release of semiconductor dies.
- Reduces the risk of damage or contamination during the release process.
- Allows for easy handling and pick up of released semiconductor dies.
Original Abstract Submitted
Methods for releasing thinned semiconductor dies from a mount tape and associated apparatuses are disclosed. In one embodiment, a sacrificial layer may be disposed at a back side of thinned substrate including semiconductor dies. The sacrificial layer includes materials soluble in contact with a fluid (and/or vapor). A sheet of perforated mount tape may be attached to the sacrificial layer and an ejection component may be provided under a target semiconductor die to be released. The ejection component is configured to create a locally confined puddle of the fluid under the target semiconductor die such that the sacrificial layer is removed to release the target semiconductor die from the mount tape. Further, a support component may be provided to pick up the target semiconductor die after the target semiconductor die is released from the mount tape.
