18242388. WAFER PROCESSING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
WAFER PROCESSING APPARATUS
Organization Name
Inventor(s)
Youngho Hwang of Suwon-si (KR)
WAFER PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18242388 titled 'WAFER PROCESSING APPARATUS
Simplified Explanation: The patent application describes a wafer processing apparatus with a plate containing support pins for mounting a wafer and vacuum ports for fixing it in place. A heater heats the plate, a flow regulator controls the vacuum pressure and fluid flow, and a chuck controller adjusts the flow rate during the wafer heating process.
- The apparatus includes a plate with support pins and vacuum ports for wafer mounting and fixation.
- A heater is used to heat the plate for wafer processing.
- A flow regulator controls the vacuum pressure and fluid flow rate.
- A chuck controller adjusts the flow rate during the wafer heating process.
- The chuck controller generates a flow control signal to reduce the fluid flow rate when needed.
Potential Applications: 1. Semiconductor manufacturing 2. Thin film deposition processes 3. MEMS fabrication 4. Photovoltaic cell production
Problems Solved: 1. Ensures secure wafer fixation during processing 2. Allows for precise control of fluid flow rate 3. Enhances heating efficiency for wafer processing
Benefits: 1. Improved wafer processing accuracy 2. Enhanced heating performance 3. Increased productivity in semiconductor manufacturing
Commercial Applications: Wafer processing equipment manufacturers can integrate this technology into their products to offer more precise and efficient processing solutions for semiconductor and other industries.
Questions about Wafer Processing Apparatus: 1. How does the flow regulator control the vacuum pressure and fluid flow rate? 2. What are the potential benefits of using this apparatus in semiconductor manufacturing processes?
Frequently Updated Research: Researchers are constantly exploring new materials and methods to improve wafer processing efficiency and accuracy, which could lead to advancements in this technology.
Original Abstract Submitted
Provided is a wafer processing apparatus including a plate having a plurality of support pins configured such that a wafer is mounted on the plurality of support pins and a plurality of vacuum ports positioned between the plurality of support pins, a heater configured to heat the plate, a flow regulator configured to provide a vacuum pressure for fixing the wafer to the plurality of vacuum ports, and configured to adjust a flow rate of a fluid flowing into the plurality of vacuum ports to be a target flow rate, and a chuck controller configured to control the target flow of the fluid set in the flow regulator, wherein the chuck controller is configured to generate a flow control signal for reducing the target flow rate of the fluid and send the flow control signal to the flow regulator during a heating process of the wafer.
