18239454. DIE BONDING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 DIE BONDING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DIE BONDING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Die Bonding Automation Technology
- 1.13 Original Abstract Submitted
DIE BONDING APPARATUS
Organization Name
Inventor(s)
Kyeongbin Lim of Suwon-si (KR)
DIE BONDING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18239454 titled 'DIE BONDING APPARATUS
Simplified Explanation
The die bonding apparatus uses magnetic fields to align two dies vertically before bonding them together.
- The apparatus includes a stage for the first die, a pickup head for the second die, and electromagnets to generate magnetic fields.
- Magnetic materials on the dies align when the magnetic field is applied, ensuring precise vertical alignment.
- This technology improves the accuracy and efficiency of die bonding processes.
Key Features and Innovation
- Use of magnetic fields for aligning dies vertically
- Electromagnets on the pickup head or stage
- Alignment of magnetic materials on the dies
- Improved precision and efficiency in die bonding processes
Potential Applications
- Semiconductor manufacturing
- Electronics assembly
- Microelectronics packaging
Problems Solved
- Inaccurate alignment of dies during bonding
- Time-consuming manual alignment processes
- Reduced yield due to misaligned dies
Benefits
- Enhanced precision in die bonding
- Increased efficiency in manufacturing processes
- Improved product quality and yield
Commercial Applications
Die Bonding Automation Technology for Semiconductor Industry
This technology can revolutionize the semiconductor industry by streamlining die bonding processes, reducing production costs, and improving overall product quality.
Prior Art
No prior art information available at this time.
Frequently Updated Research
No frequently updated research available at this time.
Questions about Die Bonding Automation Technology
Question 1
How does the magnetic field alignment system in the die bonding apparatus improve the efficiency of the bonding process?
The magnetic field alignment system ensures precise vertical alignment of the dies, reducing the need for manual adjustments and increasing the overall efficiency of the bonding process.
Question 2
What are the potential cost savings associated with implementing the die bonding automation technology in semiconductor manufacturing?
By improving precision and efficiency in die bonding processes, the technology can lead to reduced production costs, increased yield, and improved product quality, resulting in significant cost savings for semiconductor manufacturers.
Original Abstract Submitted
A die bonding apparatus comprising a stage configured to support a first die, a pickup head configured to pick up a second die, regions of magnetic materials arranged on the first die and the second die, an electromagnet arranged on a surface of the pickup head or the stage; and a controller configured to apply a current to the electromagnet to generate a magnetic field when the first die and the second die are disposed at a predetermined distance from each other in a vertical direction. As a result of the magnetic field generated by the electromagnet, the regions of magnetic material arranged on first die and the second die are aligned with one another in the vertical direction.
