18239167. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yoonyoung Jeon of Suwon-si (KR)
Woongkeon Lee of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18239167 titled 'SEMICONDUCTOR DEVICE
The semiconductor package described in the patent application consists of a complex structure involving multiple layers and materials, including redistribution structures, insulating layers, a semiconductor chip, and various conductive materials.
- The package features a first redistribution structure with alternating layers of redistribution and insulating materials, providing a robust foundation for the semiconductor chip.
- A second insulating layer above the chip includes an opening, where a pad made of a different conductive material is placed, electrically connected to the redistribution structure.
- The pad is further enhanced with a pad surface layer on its upper surface, overlapping the opening and formed of a first conductive material distinct from the pad material.
- An anchor portion protrudes from the pad's upper surface, extending higher than the lower surface of the pad surface layer, ensuring secure electrical connections and structural integrity.
Potential Applications: - This technology can be applied in various semiconductor devices and electronic components requiring precise electrical connections and insulation. - It can be utilized in advanced packaging solutions for high-performance computing, telecommunications, and automotive electronics.
Problems Solved: - The innovation addresses the need for reliable and efficient electrical connections in semiconductor packages. - It improves the structural integrity and performance of electronic devices by optimizing the design of the pad and redistribution structures.
Benefits: - Enhanced electrical connectivity and signal integrity in semiconductor packages. - Improved reliability and durability of electronic components. - Potential for miniaturization and increased functionality in electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Connectivity This technology can be commercialized in the semiconductor industry for manufacturing high-performance electronic devices, targeting markets such as data centers, telecommunications infrastructure, and automotive electronics.
Prior Art: Readers can explore prior research on semiconductor packaging technologies, materials science, and microelectronics to understand the evolution of similar innovations in the field.
Frequently Updated Research: Researchers are continuously exploring new materials and design strategies to further improve the performance and efficiency of semiconductor packaging technologies. Stay updated on the latest advancements in materials science and microelectronics research for potential breakthroughs in this area.
Questions about Semiconductor Packaging Technology: 1. How does this advanced packaging technology improve the reliability of electronic devices? 2. What are the potential challenges in implementing this complex semiconductor package design in mass production?
Original Abstract Submitted
A semiconductor package includes a first redistribution structure having at least one first redistribution layer and at least one first insulating layer that are alternately stacked, a semiconductor chip electrically connected to the first redistribution structure, a second insulating layer disposed above the semiconductor chip and having an opening, a pad electrically connected to the first redistribution structure, disposed on the second insulating layer, and overlapping the opening, a pad surface layer disposed on a first region of an upper surface of the pad to overlap the opening, the pad surface layer formed of a first conductive material different from a second conductive material forming the pad. The pad has an anchor portion protruding from a second region of the upper surface of the pad. The anchor portion protrudes to a position higher than that of a lower surface of the pad surface layer.
