18238099. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seunggeol Ryu of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18238099 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a first package with a first substrate, a first semiconductor chip, a second substrate, dummy balls, and connection terminals. Additionally, there is a second package with a third substrate and a second semiconductor chip.
- The first package includes a first substrate, a first semiconductor chip, and a second substrate.
- Dummy balls are placed on the center region and the second edge region of the first package.
- Connection terminals are located on the first edge region of the first package.
- The second package consists of a third substrate placed on the dummy balls and connection terminals, along with a second semiconductor chip.
- The dummy balls may be in contact with the second substrate and spaced apart from the third substrate.
- The connection terminals are connected to the second and third substrates.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can enhance the performance and reliability of semiconductor chips in applications such as smartphones, computers, and automotive electronics.
Problems Solved: - Improved thermal management and electrical connectivity in semiconductor packages. - Enhanced structural integrity and durability of the overall package.
Benefits: - Increased efficiency and performance of semiconductor chips. - Enhanced reliability and longevity of electronic devices. - Cost-effective manufacturing processes for semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, leading to improved functionality and reliability. The market implications include increased demand for advanced semiconductor packages in various industries such as consumer electronics, automotive, and telecommunications.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the thermal management of semiconductor packages? 2. What are the key advantages of using dummy balls in semiconductor packaging?
Original Abstract Submitted
A semiconductor package may include a first package including a first substrate, a first semiconductor chip mounted on the first substrate, and a second substrate on the first semiconductor chip, the first package having a center region, a first edge region surrounding the center region, and a second edge region surrounding the first edge region in a plan view, dummy balls disposed on the center region and the second edge region of the first package, connection terminals disposed on the first edge region of the first package, and a second package including a third substrate disposed on the dummy balls and the connection terminals and a second semiconductor chip mounted on the third substrate. The dummy balls may be in contact with the second substrate and may be spaced apart from the third substrate, and the connection terminals may be coupled to the second and third substrates.
