18237378. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Takeyuki Suzuki of Kaga Ishikawa (JP)
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18237378 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
The method of manufacturing a semiconductor device involves separating a second part from a semiconductor substrate by pressing a polishing tape against the substrate and cutting a conductive film between the separated parts.
- Semiconductor device manufacturing method:
* Separating a second part from a semiconductor substrate by pressing a polishing tape against the substrate. * Cutting a conductive film between the separated parts using the polishing tape.
Potential Applications: This technology can be used in the manufacturing of various semiconductor devices, such as integrated circuits, sensors, and memory chips.
Problems Solved: This method simplifies the process of separating different parts of a semiconductor device, improving efficiency and precision in manufacturing.
Benefits:
- Enhanced precision in separating semiconductor parts.
- Increased efficiency in semiconductor device manufacturing.
- Improved overall quality of semiconductor devices.
Commercial Applications: This technology can be applied in the semiconductor industry for mass production of high-quality devices, leading to cost savings and improved performance in electronic products.
Prior Art: Prior research in semiconductor manufacturing methods may provide insights into similar techniques for separating and cutting semiconductor parts.
Frequently Updated Research: Researchers are constantly exploring new methods and technologies to enhance semiconductor manufacturing processes, potentially leading to further advancements in this field.
Questions about Semiconductor Device Manufacturing: 1. How does this method compare to traditional techniques for separating semiconductor parts?
This method offers a more precise and efficient way to separate semiconductor parts compared to traditional methods.
2. What are the potential challenges in implementing this manufacturing method on a large scale?
Implementing this method on a large scale may require specialized equipment and training to ensure consistent results.
Original Abstract Submitted
A method of manufacturing a semiconductor device according to an embodiment includes: the method of manufacturing a semiconductor device from a substrate and a sheet, the substrate including a semiconductor substrate including a first part including a first surface and a second surface provided on the opposite side of the first surface, and an annular second part surrounding the second surface and protruding from the second surface in a direction perpendicular to the second surface, and a first conductive film provided in contact with a top surface and an inner side surface of the second part, and the second surface, the sheet being attached to the first conductive film provided in contact with the top surface and the inner side surface of the second part, and the second surface; the method comprising: separating the second part from the first part by pressing a polishing tape against the first surface provided on the opposite side of the second part and polishing the semiconductor substrate; and cutting the first conductive film between the first part and the separated second part by pressing the polishing tape against the first conductive film between the first part and the separated second part.
