18236664. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
JUNHYEONG Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18236664 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
The semiconductor package described in the patent application consists of a first structure with a conductive pattern, a second structure spaced apart from the first structure, a pillar structure connecting the two structures electrically, and a semiconductor chip placed between them. The pillar structure includes an inner pillar on the conductive pattern and an outer pillar surrounding the inner pillar, making contact with the inner pillar's sidewall and top surface.
- The semiconductor package includes a unique pillar structure with inner and outer pillars for improved electrical connection.
- The design allows for efficient communication between the first and second structures in the package.
- The presence of the semiconductor chip enhances the functionality of the package.
- The conductive pattern within the first structure plays a crucial role in the overall performance of the semiconductor package.
- The spacing between the first and second structures ensures proper functioning and connectivity within the package.
Potential Applications: - This technology can be utilized in various electronic devices requiring semiconductor packages. - It can be beneficial in the manufacturing of advanced microchips and integrated circuits.
Problems Solved: - Improved electrical connection within semiconductor packages. - Enhanced functionality and performance of electronic devices. - Efficient communication between different components in the package.
Benefits: - Enhanced reliability and durability of semiconductor packages. - Improved overall performance of electronic devices. - Cost-effective manufacturing processes for advanced microchips.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Electronic Devices This technology can be applied in the production of smartphones, computers, and other consumer electronics, enhancing their performance and reliability in the market.
Questions about Semiconductor Packages: 1. How does the unique pillar structure in this semiconductor package improve electrical connectivity? The unique pillar structure with inner and outer pillars ensures efficient electrical connection between different components in the package, enhancing overall performance.
2. What role does the conductive pattern play in the functionality of the semiconductor package? The conductive pattern within the first structure is crucial for facilitating communication and connectivity within the semiconductor package, contributing to its efficient operation.
Original Abstract Submitted
Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a first structure that includes a conductive pattern, a second structure spaced apart from the first structure, a pillar structure between the first structure and the second structure and electrically connecting the first structure to the second structure, and a semiconductor chip between the first structure and the second structure. The pillar structure includes an inner pillar on the conductive pattern and an outer pillar that surrounds the inner pillar. The outer pillar is in contact with a sidewall and a top surface of the inner pillar.
