18236435. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Dong Wook Kim of Suwon-si (KR)
Sang Wuk Park of Suwon-si (KR)
Geon Yeop Lee of Suwon-si (KR)
Jung Pyo Hong of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18236435 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a substrate with an active area, first and second landing pads connected to the active area, first and second lower electrodes extending in a direction perpendicular to the substrate, a dielectric layer, and an upper electrode.
- The device includes a substrate with an active area.
- Two landing pads connected to the active area and spaced apart on the substrate.
- Lower electrodes extending perpendicular to the substrate.
- A dielectric layer covering the lower electrodes.
- An upper electrode on top of the dielectric layer.
Potential Applications
The technology described in this patent application could be used in various semiconductor devices such as capacitors, memory devices, and sensors.
Problems Solved
This technology helps in improving the performance and efficiency of semiconductor devices by providing a structured layout for the components.
Benefits
The benefits of this technology include increased functionality, improved reliability, and enhanced performance of semiconductor devices.
Potential Commercial Applications
The potential commercial applications of this technology could include the manufacturing of advanced electronic devices for various industries such as consumer electronics, telecommunications, and automotive.
Possible Prior Art
One possible prior art for this technology could be the use of similar structured layouts in semiconductor devices to improve performance and efficiency.
Unanswered Questions
How does this technology compare to existing semiconductor devices in terms of performance and efficiency?
This article does not provide a direct comparison with existing semiconductor devices to evaluate the performance and efficiency improvements offered by this technology.
What are the specific manufacturing processes involved in producing this semiconductor device?
The article does not detail the specific manufacturing processes involved in producing this semiconductor device, such as deposition techniques, etching methods, or material selection.
Original Abstract Submitted
A semiconductor device includes: a substrate includes an active area; a first landing pad connected to the active area and disposed on the substrate; a second landing pad connected to the active area, and spaced apart from the first landing pad, wherein the second landing pad is disposed on the substrate; a first lower electrode disposed on the first landing pad and extending in a direction substantially perpendicular to the substrate; a second lower electrode disposed on the second landing pad and extending in the direction substantially perpendicular to the substrate; a dielectric layer extending along the first lower electrode and the second lower electrode; and an upper electrode disposed on the dielectric layer, wherein a first upper surface of the first landing pad is disposed below a second upper surface of the second landing pad with respect to a lower surface of the substrate.
