18236024. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Youngdeuk Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18236024 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of three vertically stacked semiconductor chips that are electrically connected. An encapsulant covers a portion of each chip, with external connection bumps below the first chip for electrical connection. The chips have lower pads, upper pads (including two groups), and through-electrodes connecting the upper and lower pads.
- The semiconductor package includes three vertically stacked semiconductor chips.
- An encapsulant covers a portion of each chip for protection.
- External connection bumps below the first chip enable electrical connection.
- The chips have lower pads and upper pads, including two groups.
- Through-electrodes connect the upper pads to the lower pads for electrical connectivity.
Potential Applications: - This technology can be used in various electronic devices requiring compact and efficient semiconductor packaging. - It can be applied in mobile devices, IoT devices, and other consumer electronics for improved performance and space utilization.
Problems Solved: - Addresses the need for compact and reliable semiconductor packaging solutions. - Ensures efficient electrical connectivity between stacked semiconductor chips.
Benefits: - Improved space utilization in electronic devices. - Enhanced electrical connectivity and reliability. - Potential for increased performance in semiconductor devices.
Commercial Applications: Title: "Compact Semiconductor Packaging for Enhanced Device Performance" This technology can be commercialized in the semiconductor industry for manufacturing advanced electronic devices with improved performance and reliability. It can cater to the growing demand for compact and efficient semiconductor packaging solutions in various consumer electronics.
Prior Art: Information on prior art related to this technology is not provided in the abstract.
Frequently Updated Research: There is no information available on frequently updated research relevant to this technology at the moment.
Questions about Semiconductor Packaging: 1. How does this semiconductor packaging technology compare to traditional packaging methods? 2. What are the potential challenges in implementing this compact semiconductor packaging in mass production?
Question 1: How does this semiconductor packaging technology compare to traditional packaging methods? Answer 1: This semiconductor packaging technology offers a more compact and efficient solution compared to traditional methods, allowing for stacked semiconductor chips with improved space utilization and electrical connectivity.
Question 2: What are the potential challenges in implementing this compact semiconductor packaging in mass production? Answer 2: Some potential challenges in mass production could include ensuring uniform encapsulation of each chip, precise alignment of through-electrodes, and maintaining consistent electrical connectivity between the stacked chips. These challenges would need to be addressed to ensure the reliability and scalability of this technology in commercial production.
Original Abstract Submitted
A semiconductor package includes electrically connected first to third semiconductor chips, stacked in a vertical direction; an encapsulant on the first semiconductor chip and encapsulating a portion of each of the semiconductor chips; and external connection bumps below the first semiconductor chip and being electrically connected to the semiconductor chips, wherein the semiconductor chips each include a plurality of lower pads, the first and second semiconductor chips each include a plurality of upper pads including a first group of upper pads and a second group of upper pads, and through-electrodes electrically respectively connecting the upper pads and the lower pads, and the through-electrodes include a first group of through-electrodes respectively connected to the first group of upper pads, and a second group of through-electrodes connected to upper pads that are electrically connected to each other of the second group of upper pads.
