18235593. IMAGE SENSOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
IMAGE SENSOR PACKAGE
Organization Name
Inventor(s)
IMAGE SENSOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18235593 titled 'IMAGE SENSOR PACKAGE
The image sensor package described in the patent application includes an image sensor chip with a central sensing area and an outer surrounding area, a transparent substrate covering the chip, a bonding structure between the chip and substrate, and a package substrate for mounting and connecting the chip.
- The image sensor chip features a photo absorption layer that encloses the edge of the sensing area and protrudes a pattern towards the bonding structure.
- The transparent substrate is positioned above the image sensor chip, providing protection and support.
- The bonding structure ensures a secure connection between the chip and the substrate.
- The package substrate allows for mounting and electrical connection of the image sensor chip.
Potential Applications: - This technology can be used in digital cameras, smartphones, and other electronic devices requiring high-quality image sensors. - It can also be applied in security cameras, medical imaging devices, and automotive cameras.
Problems Solved: - Provides enhanced protection and support for image sensor chips. - Ensures secure electrical connections between components. - Improves the overall performance and longevity of image sensor packages.
Benefits: - Enhanced image quality and reliability in electronic devices. - Increased durability and longevity of image sensor packages. - Improved performance in various applications requiring image sensors.
Commercial Applications: Title: Advanced Image Sensor Package Technology for Electronic Devices This technology can be commercially utilized in the development of digital cameras, smartphones, security cameras, medical imaging devices, and automotive cameras. It offers improved image quality, reliability, and performance, making it a valuable innovation in the electronics industry.
Questions about Image Sensor Package Technology: 1. How does the bonding structure enhance the performance of the image sensor package? The bonding structure ensures a secure connection between the image sensor chip and the transparent substrate, improving overall reliability and performance.
2. What are the potential applications of this advanced image sensor package technology? This technology can be applied in various electronic devices such as digital cameras, smartphones, security cameras, medical imaging devices, and automotive cameras, enhancing image quality and reliability.
Original Abstract Submitted
An image sensor package according to an embodiment includes: an image sensor chip having a sensing area of a central part and an outer area surrounding the sensing area; a transparent substrate spaced apart from and above the image sensor chip and covering the image sensor chip; a bonding structure disposed between the image sensor chip and the transparent substrate and provided on an upper surface of the outer area; and a package substrate on which the image sensor chip is mounted and electrically connected to the image sensor chip, wherein the image sensor chip, on a plane, includes a photo absorption layer enclosing the edge of the sensing area and having a pattern protruded toward the bonding structure along a circumference.
