18235528. PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE simplified abstract (HYUNDAI MOBIS CO., LTD.)

PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE

Organization Name

HYUNDAI MOBIS CO., LTD.

Inventor(s)

Jae Joon Chang of Yongin-si (KR)

Hyeon Don Kim of Yongin-si (KR)

Eun Chang Lee of Yongin-si (KR)

Jae Min Lee of Yongin-si (KR)

Byeong Chan Song of Chilgok-gun (KR)

Hyun Lee of Asan-si (KR)

Tae Won Hwang of Cheonan-si (KR)

So Yeon Lim of Cheonan-si (KR)

PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18235528 titled 'PHOTOCURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR ELECTRICAL COMPONENTS WITH THREE-DIMENSIONAL STRUCTURE

Simplified Explanation

The present invention is a functional pressure-sensitive composition with high heat resistance and bending resistance characteristics, comprising:

• 40 to 55 wt % of a urethane acrylate oligomer
• 30 to 44 wt % of an acrylate monomer
• 2 to 5 wt % of a photoinitiator
• 0.2 to 2 wt % of a silane coupling agent
• 0.1 to 1 wt % of a light stabilizer
• 0.1 to 1 wt % of an ultraviolet absorber
• 0.1 to 1 wt % of an antioxidant

This composition is used in an electrical component with a 3D structure.

Potential Applications

The technology can be applied in various industries such as electronics, automotive, aerospace, and construction for manufacturing pressure-sensitive components with high heat and bending resistance.

Problems Solved

The composition addresses the need for pressure-sensitive materials that can withstand high temperatures and bending without losing their adhesive properties.

Benefits

- High heat resistance - Bending resistance - Adhesive properties - Suitable for 3D structures

Potential Commercial Applications

"High Heat Resistance Pressure-Sensitive Composition for Electrical Components" can be used in the production of electrical components, automotive parts, electronic devices, and other applications requiring durable pressure-sensitive materials.

Possible Prior Art

Prior art may include similar compositions used in the manufacturing of pressure-sensitive materials, but the specific combination of ingredients for high heat and bending resistance may be unique to this invention.

How does this composition compare to existing pressure-sensitive materials in terms of cost-effectiveness and performance?

The article does not provide information on the cost-effectiveness of this composition compared to existing materials or its performance in real-world applications.

What are the specific electrical components that can benefit the most from this technology, and how does it improve their functionality?

The article does not specify the types of electrical components that can benefit the most from this technology or how it enhances their functionality.

Original Abstract Submitted

The present invention relates to a functional pressure-sensitive composition having high heat resistance and bending resistance characteristics, including: 40 to 55 wt % of a urethane acrylate oligomer, 30 to 44 wt % of an acrylate monomer, 2 to 5 wt % of a photoinitiator, 0.2 to 2 wt % of a silane coupling agent, 0.1 to 1 wt % of a light stabilizer, 0.1 to 1 wt % of an ultraviolet absorber and 0.1 to 1 wt % of an antioxidant, and an electrical component with a 3D structure using the same.