18233296. MEMORY PACKAGE EXPANSION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
MEMORY PACKAGE EXPANSION
Organization Name
Inventor(s)
Casey Glenn Thielen of Chandler AZ (US)
Douglas Joseph of Austin TX (US)
MEMORY PACKAGE EXPANSION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18233296 titled 'MEMORY PACKAGE EXPANSION
The memory solution device described in the patent application includes a logic die, a high-bandwidth memory, and a first memory die. The logic die may be a central processing unit or an accelerator, with a first surface. The high-bandwidth memory die is located on the first surface at a first predetermined location, while the first memory die is located on the first surface at a second predetermined location different from the first.
- Logic die can be a central processing unit or an accelerator
- High-bandwidth memory die is located on the first surface at a first predetermined location
- First memory die is located on the first surface at a second predetermined location
- First memory die can be a read-only memory, random access memory, non-volatile memory, or a combination thereof
Potential Applications: - High-performance computing systems - Data centers - Artificial intelligence applications
Problems Solved: - Efficient memory management - High-speed data processing - Enhanced system performance
Benefits: - Improved data processing speed - Enhanced memory capabilities - Optimal system performance
Commercial Applications: Title: "Next-Generation Memory Solution for High-Performance Computing" This technology can be used in high-performance computing systems, data centers, and artificial intelligence applications, improving overall system performance and data processing speed.
Questions about Memory Solution Device: 1. How does the placement of the high-bandwidth memory and first memory die on the logic die surface impact system performance? 2. What are the potential drawbacks of integrating different types of memory dies on the logic die surface?
Frequently Updated Research: Stay updated on the latest advancements in memory management and high-performance computing systems to enhance the efficiency and capabilities of the memory solution device.
Original Abstract Submitted
A memory solution device may include a logic die, a high-bandwidth memory, and a first memory die. The logic die may be a central processing unit or an accelerator, and may include a first surface. The high-bandwidth memory die may be located on the first surface at a first predetermined location. The first memory die may be located on the first surface at a second predetermined location that is different from the first predetermined location. The first memory die may be a read-only memory, a random access memory, a non-volatile memory, or a combination thereof.
