18230416. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18230416 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of several key components:
- First redistribution layer
- First semiconductor chip
- Mold layer
- Metal layer
- Second redistribution layer
Key Features and Innovation: - The mold layer covers the side surface of the first semiconductor chip and the top surface of the first redistribution layer, with an upper surface coplanar with the upper surface of the first semiconductor chip. - The metal layer is in contact with the upper surfaces of the mold layer and the first semiconductor chip. - The second redistribution layer is on the metal layer.
Potential Applications: - Semiconductor packaging industry - Electronics manufacturing - Integrated circuits
Problems Solved: - Improved protection for semiconductor chips - Enhanced connectivity within the package - Increased durability and reliability
Benefits: - Higher performance and efficiency - Reduced risk of damage to semiconductor chips - Enhanced overall product quality
Commercial Applications: - This technology can be used in the production of various electronic devices such as smartphones, computers, and automotive electronics. It can also benefit companies involved in semiconductor packaging and manufacturing.
Questions about the technology: 1. How does the mold layer contribute to the overall protection of the semiconductor chip? 2. What are the advantages of having a metal layer in contact with the mold layer and the semiconductor chip?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
A semiconductor package includes a first redistribution layer, a first semiconductor chip on the first redistribution layer, a mold layer covering a side surface of the first semiconductor chip and a top surface of the first redistribution layer and having an upper surface coplanar with an upper surface of the first semiconductor chip, a metal layer on the first semiconductor chip and the mold layer to be in contact with upper surfaces of the mold layer and the first semiconductor chip, and a second redistribution layer on the metal layer.
