18229824. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18229824 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract of the patent application describes a semiconductor package that includes various components such as a semiconductor chip, redistribution structures, a conductive post, and a wire for dissipating heat.
- The semiconductor package consists of a semiconductor chip, which is the main component.
- The lower redistribution structure is electrically connected to the semiconductor chip.
- An upper redistribution structure is present on the semiconductor chip.
- A conductive post is used to connect the upper redistribution structure to the lower redistribution structure.
- A first wire is used to connect the lower surface of the semiconductor chip to the upper surface of the lower redistribution structure for heat dissipation.
Potential applications of this technology:
- Semiconductor packages are widely used in various electronic devices such as smartphones, computers, and automotive electronics.
- This technology can be applied in the manufacturing of high-performance integrated circuits.
- It can be used in the development of advanced electronic systems requiring efficient heat dissipation.
Problems solved by this technology:
- Heat dissipation is a critical issue in semiconductor devices as excessive heat can degrade performance and reliability.
- This technology addresses the problem of heat accumulation in the semiconductor chip by providing a wire for dissipating heat.
Benefits of this technology:
- Improved heat dissipation capabilities enhance the performance and reliability of semiconductor chips.
- The use of redistribution structures and conductive posts allows for efficient electrical connections within the semiconductor package.
- This technology enables the development of smaller and more compact semiconductor packages.
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip, a lower redistribution structure electrically connected to the first semiconductor chip, an upper redistribution structure on the first semiconductor chip, a conductive post electrically connecting the upper redistribution structure to the lower redistribution structure, and a first wire connecting a lower surface of the first semiconductor chip with an upper surface of the lower redistribution structure to dissipate heat of the first semiconductor chip.
