18229026. RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD
Organization Name
Inventor(s)
RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18229026 titled 'RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD
Simplified Explanation
The patent application describes a retainer ring for a chemical mechanical polishing apparatus, with a slurry groove that is recessed from the bottom surface of the ring and extends in an arc shape from the inner surface towards the outer surface. The curvature radius of the slurry groove is greater than the distance between the center of the ring and the curvature center of the groove.
- Retainer ring with slurry groove recessed from bottom surface
- Slurry groove extends in arc shape from inner to outer surface
- Curvature radius of groove is greater than distance to center of ring
Potential Applications
The technology could be used in the manufacturing of semiconductor devices, optical components, and other precision-engineered products that require substrate polishing.
Problems Solved
The technology helps to improve the efficiency and precision of substrate polishing processes by ensuring uniform distribution of slurry during polishing.
Benefits
- Enhanced polishing performance - Improved substrate flatness - Reduced polishing time and cost
Potential Commercial Applications
"Advanced Substrate Polishing Technology for Semiconductor Manufacturing"
Possible Prior Art
There may be prior art related to retainer rings for chemical mechanical polishing apparatuses, but specific details are not provided in the patent application.
Unanswered Questions
How does the design of the slurry groove impact the overall polishing process?
The design of the slurry groove affects the distribution of slurry during polishing, which can impact the uniformity and quality of the polished substrate.
Are there any specific materials recommended for the construction of the retainer ring?
The patent application does not specify any particular materials for the retainer ring, so it is unclear if certain materials are preferred for optimal performance.
Original Abstract Submitted
Provided is a retainer ring, a chemical mechanical polishing apparatuses including the same, and a substrate polishing method using the same. A slurry groove is upwardly recessed from a bottom surface of the retainer ring. The slurry groove extends in an arc shape from an inner surface of the retainer ring toward an outer surface of the retainer ring. A curvature radius of the slurry groove is greater than a distance between a center of the retainer ring and a curvature center of the slurry groove.
