18228481. POLISHING PROCESS APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
POLISHING PROCESS APPARATUS
Organization Name
Inventor(s)
Donghoon Kwon of Suwon-si (KR)
POLISHING PROCESS APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18228481 titled 'POLISHING PROCESS APPARATUS
The patent application describes a polishing process apparatus that includes a carrier for supporting an object, a platen with at least one eddy current sensor, a power supply circuit, a voltage detection circuit, a polishing pad, and a controller.
- The apparatus utilizes eddy current sensors to measure the thickness of a target layer during a polishing process.
- The power supply circuit provides power to the coil of the eddy current sensor to generate eddy currents.
- The voltage detection circuit detects raw voltage data from the coil.
- The controller acquires and processes data from the voltage detection circuit to measure the thickness of the target layer.
- Different filters are applied to the acquired data to enhance accuracy in measuring the thickness of the target layer.
Potential Applications: - Semiconductor manufacturing processes - Thin film deposition processes - Optical coatings
Problems Solved: - Accurate measurement of thin film thickness during polishing processes - Enhanced process control and quality assurance
Benefits: - Improved precision in measuring thin film thickness - Increased efficiency in polishing processes - Enhanced product quality and consistency
Commercial Applications: Title: "Advanced Thin Film Thickness Measurement Apparatus for Semiconductor Manufacturing" This technology can be used in semiconductor manufacturing facilities to improve the quality and efficiency of thin film deposition processes. It can also be utilized in industries requiring precise control over thin film thickness for optical coatings and other applications.
Prior Art: No specific information on prior art related to this technology is provided in the abstract.
Frequently Updated Research: There is ongoing research in the field of thin film deposition processes and measurement techniques to further enhance the accuracy and efficiency of thin film manufacturing.
Questions about the technology:
Question 1: How does the use of eddy current sensors improve the accuracy of measuring thin film thickness during polishing processes? Answer: Eddy current sensors provide non-contact measurement capabilities, allowing for precise monitoring of changes in the target layer thickness without interfering with the polishing process.
Question 2: What are the potential challenges in integrating this advanced thickness measurement apparatus into existing semiconductor manufacturing processes? Answer: Some challenges may include calibration of the sensors, compatibility with existing equipment, and ensuring real-time data processing for effective process control.
Original Abstract Submitted
A polishing process apparatus includes a carrier configured to support an object, a platen provided below the carrier and configured to accommodate at least one eddy current sensor, the at least one eddy current sensor including a coil configured to output an eddy current, a power supply circuit configured to supply power to the coil and a voltage detection circuit connected to the coil and configured to detect raw voltage data, a polishing pad on an upper surface of the platen, and a controller configured to acquire first data by receiving the raw voltage data from the voltage detection circuit a plurality of times while a polishing process is performed on the object, acquire second data by sequentially applying a first filter and a second filter to the first data, the first filter being different from the second filter and measure a thickness of a target layer included in the object based on the second data.
