18227646. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Seung-Kwan Ryu of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18227646 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
The present disclosure introduces semiconductor packages and methods for their fabrication. These packages include a substrate with first and second regions, each having a pad and a dielectric layer with openings exposing the pads. Bump structures are placed on the pads, with the first dielectric layer thicker than the second. The distance between the substrate and the uppermost end of the first bump structure is longer than that of the second bump structure.
- Substrate with first and second regions
- Pads on each region
- Dielectric layers with openings exposing the pads
- Bump structures on the pads
- Varying thickness of dielectric layers
- Different distances between substrate and bump structures
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit packaging
Problems Solved: - Improved electrical connections - Enhanced reliability in semiconductor packages
Benefits: - Better performance in electronic devices - Increased durability of semiconductor packages
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, improving their reliability and longevity in various industries such as telecommunications, automotive, and consumer electronics.
Questions about Semiconductor Packaging Technology: 1. How does the varying thickness of dielectric layers impact the performance of the semiconductor package? The thickness of the dielectric layers can affect the electrical properties and reliability of the package, potentially improving signal integrity and reducing interference.
2. What are the advantages of having different distances between the substrate and the bump structures? The varying distances can help optimize the electrical connections and thermal management within the package, leading to better overall performance.
Original Abstract Submitted
The present disclosure provides semiconductor packages and methods of fabricating the same. In some embodiments, a semiconductor package includes a substrate including first and second regions, a first pad on the first region, a second pad on the second region, a first dielectric layer on the first region and including a first opening exposing the first pad, a second dielectric layer on the second region and including a second opening exposing the second pad, a first bump structure on the first pad and in the first opening, and a second bump structure on the second pad and in the second opening. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer. A distance between the substrate and an uppermost end of the first bump structure is longer than a distance between the substrate and an uppermost end of the second bump structure.
