18227563. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Hyoung Uk Kim of Suwon-si (KR)
Hyung Soon Kwon of Suwon-si (KR)
Kwang Hee Nam of Suwon-si (KR)
Seok Hyun Yoon of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18227563 titled 'MULTILAYER ELECTRONIC COMPONENT
The abstract of the patent application describes a multilayer electronic component with a unique dielectric grain structure and internal electrodes connected to an external electrode on the body.
- The dielectric grains in the component contain Ba, Ti, Sn, and a rare earth element, with a core-dual shell structure for enhanced performance.
- The core-dual shell structure includes a core, a first shell on part of the core, and a second shell on part of the first shell.
- Specific molar ratios of Sn to Ti and the rare earth element to Ti in the shells contribute to the component's properties.
Potential Applications: - This technology can be used in various electronic devices requiring high-performance multilayer components. - It can be applied in telecommunications, consumer electronics, and automotive electronics.
Problems Solved: - Improved performance and reliability of multilayer electronic components. - Enhanced electrical properties and stability in different operating conditions.
Benefits: - Increased efficiency and functionality of electronic devices. - Better signal transmission and reduced signal loss. - Longer lifespan and durability of electronic components.
Commercial Applications: Title: Advanced Multilayer Electronic Components for Enhanced Performance in Various Industries This technology can be utilized in the manufacturing of capacitors, filters, and other electronic components for a wide range of industries, leading to improved product quality and performance.
Questions about Multilayer Electronic Component with Core-Dual Shell Structure: 1. How does the core-dual shell structure contribute to the performance of the electronic component? The core-dual shell structure enhances the electrical properties and stability of the component by providing a unique configuration for the dielectric grains.
2. What are the specific molar ratios of Sn to Ti and the rare earth element to Ti in the first and second shells? The average molar ratios of Sn to Ti and the rare earth element to Ti in the shells play a crucial role in determining the properties and performance of the electronic component.
Original Abstract Submitted
A multilayer electronic component includes: a body including a dielectric layer including a plurality of dielectric grains and internal electrodes alternately disposed with the dielectric layer; and an external electrode disposed on the body and connected to the internal electrodes At least one of the plurality of dielectric grains includes Ba, Ti, Sn, and a rare earth element and has a core-dual shell structure, which includes a core, a first shell disposed on at least a portion of the core, and a second shell disposed on at least a portion of the first shell. When an average molar ratio of Sn to Ti included in the first and second shells is S1 and S2, respectively, and an average molar ratio of the rare earth element to Ti included in the first and second shells is R1 and R2, respectively, S1>S2 and R2>R1 are satisfied.
