18226990. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Unbyoung Kang of Suwon-si (KR)
Sangsick Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18226990 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
The method described in the patent application involves manufacturing a semiconductor package by stacking multiple memory dies using an adhesive member, forming a molding member to cover the memory die stack, polishing the upper surface of the molding member to expose the uppermost memory die, removing edge portions of the uppermost memory die along with parts of the molding and adhesive members to create a stepped portion, and finally forming a second molding member to cover the stepped portion.
- Stacking multiple memory dies using an adhesive member
- Forming a first molding member to cover the memory die stack
- Polishing the upper surface to expose the uppermost memory die
- Removing edge portions of the uppermost memory die to create a stepped portion
- Forming a second molding member to cover the stepped portion
Potential Applications: - Semiconductor packaging industry - Memory module manufacturing - Electronic devices requiring compact memory storage
Problems Solved: - Efficient stacking and packaging of memory dies - Ensuring proper protection and insulation of memory components - Facilitating compact and reliable semiconductor packages
Benefits: - Improved memory module density - Enhanced protection of memory dies - Streamlined manufacturing process
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Memory Modules This technology can be utilized in the production of various electronic devices such as smartphones, tablets, laptops, and other gadgets that require efficient memory storage solutions.
Prior Art: There may be existing patents related to semiconductor packaging methods involving stacking memory dies and forming molding members, but the specific technique of creating a stepped portion by removing edge portions of the uppermost memory die may be unique to this patent application.
Frequently Updated Research: There may be ongoing research in the semiconductor packaging industry focusing on improving memory module density and efficiency through innovative stacking and molding techniques.
Questions about Semiconductor Packaging Technology: 1. How does this method compare to traditional semiconductor packaging techniques? 2. What are the potential challenges in implementing this advanced packaging technology in mass production?
Original Abstract Submitted
A method of manufacturing a semiconductor package comprises stacking, via an adhesive member, a plurality of memory dies to form a memory die stack on a buffer die; forming a first molding member on the buffer die to cover the memory die stack; polishing an upper surface of the first molding member to expose an upper surface of an uppermost memory die in the memory die stack, the uppermost memory die positioned in an uppermost layer in the memory die stack; removing edge portions of the uppermost memory die together with at least a portion of the first molding member and at least a portion of the adhesive member to form a stepped portion; and forming a second molding member on the first molding member to cover the stepped portion of the uppermost memory die.
