18226873. CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS
Organization Name
Inventor(s)
Sungyong Park of Suwon-si (KR)
Hyunjoon Park of Suwon-si (KR)
CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18226873 titled 'CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS
The patent application describes a cleaner for a CMP apparatus, which includes a cleaning body, cleaning nozzles, a vision system, and a controller. The cleaner is designed to prevent scratches on the substrate during the cleaning process.
- The cleaning body is positioned under the polishing head of the CMP apparatus and is used to apply a cleaning solution to the polishing head.
- The cleaning nozzles are located on the cleaning body and inject the cleaning solution onto the polishing head.
- The vision system captures images of the polishing head to help the controller adjust the amount of cleaning solution sprayed by each cleaning nozzle.
- By individually controlling the cleaning solution flow based on the images, the cleaner prevents defects and scratches on the substrate.
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Nanotechnology research
Problems Solved: - Preventing scratches on substrates during CMP cleaning processes - Improving cleaning efficiency and accuracy - Reducing defects in semiconductor manufacturing
Benefits: - Enhanced substrate quality - Increased yield in manufacturing processes - Cost savings from reduced defects and rework
Commercial Applications: Title: Advanced CMP Cleaner for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to improve the cleaning process and enhance the quality of substrates, leading to higher yields and cost savings.
Questions about the technology: 1. How does the vision system help improve the cleaning process? The vision system captures images of the polishing head to adjust the amount of cleaning solution sprayed by each nozzle, preventing scratches on the substrate. 2. What are the key benefits of using this cleaner in semiconductor manufacturing? The key benefits include improved substrate quality, increased yield, and cost savings from reduced defects and rework.
Original Abstract Submitted
A cleaner for a CMP apparatus includes a cleaning body, a plurality of cleaning nozzles, a vision system and a controller. The cleaning body may be arranged under a polishing head of the CMP apparatus configured to hold a substrate. The cleaning body may be configured to receive a cleaning solution for cleaning the polishing head. The cleaning nozzles may be arranged at the cleaning body to inject the cleaning solutions to the polishing head. The vision system may photograph the polishing head to which the cleaning solution may be injected to obtain an image of the polishing head. The controller may individually control amounts of the cleaning solutions injected from the cleaning nozzles based on the image of the polishing head. Thus, a scratch caused by a defect may not be generated at the substrate.
