18226589. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18226589 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation: The semiconductor package described in the patent application consists of two substrates with pads and connection terminals that facilitate the coupling of the pads.
- The semiconductor package includes a first substrate with first pads, a second substrate with second pads, and connection terminals linking the two substrates.
- Each connection terminal has a major and minor axis parallel to the first substrate's surface, with the minor axis pointing towards the center of the first substrate.
Key Features and Innovation:
- Integration of first and second substrates with connection terminals for improved semiconductor packaging.
- Orientation of connection terminals for efficient coupling of pads between substrates.
Potential Applications: The technology can be applied in various semiconductor packaging processes, especially in compact electronic devices where space optimization is crucial.
Problems Solved: The innovation addresses the need for efficient and reliable semiconductor packaging methods that ensure proper connectivity between substrates.
Benefits:
- Enhanced performance and reliability of semiconductor packages.
- Improved space utilization in electronic devices.
Commercial Applications: The technology can be utilized in the manufacturing of smartphones, tablets, laptops, and other electronic devices where compact and reliable semiconductor packaging is essential.
Prior Art: Readers can explore prior research on semiconductor packaging methods, connection terminals, and substrate coupling in the field of microelectronics.
Frequently Updated Research: Stay updated on advancements in semiconductor packaging technologies, materials, and manufacturing processes to enhance the efficiency and reliability of electronic devices.
Questions about Semiconductor Packaging: 1. What are the key components of a semiconductor package and how do they contribute to its functionality? 2. How does the orientation of connection terminals impact the performance of semiconductor packages?
Original Abstract Submitted
Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a first substrate having first pads on a first surface of the first substrate, a second substrate on the first substrate and having a plurality of second pads on a second surface of the second substrate, and connection terminals between the first substrate and the second substrate and correspondingly coupling the first pad to the second pads. Each of the connection terminals has a first major axis and a first minor axis that are parallel to the first surface of the first substrate and are orthogonal to each other. When viewed in a plan view, the first minor axis of each of the connection terminals is directed toward a center of the first substrate.
