18226534. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18226534 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes multiple semiconductor chips stacked on top of each other and connected through redistribution structures and vertical connection conductors. The package also includes a molded portion that surrounds the chips and a second redistribution structure on the top chip. The third chip is connected to the second redistribution structure.
- The semiconductor package includes multiple semiconductor chips stacked on top of each other.
- The chips are connected through redistribution structures and vertical connection conductors.
- The package includes a molded portion that surrounds the chips.
- The top chip has a second redistribution structure.
- The third chip is connected to the second redistribution structure.
Potential applications of this technology:
- This semiconductor package can be used in various electronic devices such as smartphones, tablets, and laptops.
- It can be used in high-performance computing systems and data centers.
- The technology can be applied in automotive electronics, medical devices, and industrial equipment.
Problems solved by this technology:
- The stacked semiconductor chips allow for increased functionality and performance in a compact form factor.
- The redistribution structures and vertical connection conductors enable efficient interconnection between the chips.
- The molded portion provides protection and stability to the stacked chips.
Benefits of this technology:
- The semiconductor package offers higher integration and miniaturization, enabling smaller and more portable electronic devices.
- The stacked chip design allows for improved performance and functionality without increasing the overall size of the package.
- The efficient interconnection between the chips enhances signal transmission and reduces power consumption.
Original Abstract Submitted
A semiconductor package includes a first redistribution structure having a first redistribution layer; a first semiconductor chip on the first redistribution structure, and having first lower pads, first upper pads, and first through-electrodes; a second semiconductor chip on the first semiconductor chip, and having second lower pads, second upper pads, and second through-electrodes; a vertical connection conductor on the first redistribution structure, and connected to the first redistribution layer; a molded portion on the first redistribution structure, and surrounding the first second semiconductor chips; a second redistribution structure on the second semiconductor chip and the vertical connection conductor, the second redistribution structure having a second redistribution layer connected to the second upper pads and the vertical connection conductor; and a third semiconductor chip on the second redistribution structure, and having contact pads connected to the second redistribution layer.
