18226180. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyeonjeong Hwang of Suwon-si (KR)
Kyoung Lim Suk of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18226180 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a first redistribution substrate, a semiconductor chip, a mold layer, a first passive device, an insulating pattern, and a second redistribution substrate.
- The first redistribution substrate serves as a base for the semiconductor chip.
- The mold layer covers the semiconductor chip and has a first opening to expose a portion of the chip's top surface.
- The first passive device is placed on the exposed portion of the semiconductor chip.
- An insulating pattern fills the first opening and covers part of the first passive device.
- The second redistribution substrate is positioned on top of the mold layer.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of semiconductor chips in applications such as smartphones, computers, and automotive electronics.
Problems Solved: - Enhances the integration of passive devices onto semiconductor chips. - Provides a more efficient and reliable packaging solution for semiconductor devices.
Benefits: - Increased functionality and performance of semiconductor packages. - Improved thermal management and electrical connectivity. - Enhanced overall reliability and durability of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be applied in the production of high-performance electronic devices, catering to industries such as consumer electronics, telecommunications, and automotive.
Questions about Semiconductor Packaging: 1. How does this technology improve the integration of passive devices onto semiconductor chips?
- This technology allows for more efficient placement and connection of passive devices, enhancing overall functionality and performance.
2. What are the potential benefits of using this advanced semiconductor packaging technology?
- The benefits include improved device performance, enhanced thermal management, and increased reliability in electronic devices.
Original Abstract Submitted
A semiconductor package may include a first redistribution substrate, a semiconductor chip disposed on the first redistribution substrate, a mold layer covering the semiconductor chip and including a first opening exposing a portion of a top surface of the semiconductor chip, a first passive device disposed on the portion of the top surface of the semiconductor chip exposed by the first opening, an insulating pattern filling the first opening and covering at least a portion of the first passive device, and a second redistribution substrate disposed on the mold layer. The first passive device may be spaced apart from the mold layer, with the insulating pattern interposed therebetween.
