18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18226065 titled 'SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF
The present disclosure introduces a semiconductor package with a dummy solder and its manufacturing process.
- Solder bump array is located on one surface of the semiconductor package.
- A dummy solder is symmetrically placed around the center of the solder bump array.
- The solder bumps have a higher melting point compared to the dummy solder.
- The dummy solder melts first in the soldering process, creating a force that aids in connecting the solder bump to the external device's terminal.
- This process is facilitated by surface tension.
- Potential Applications:**
This technology can be applied in the manufacturing of various electronic devices that require precise soldering processes.
- Problems Solved:**
This innovation addresses the challenge of ensuring proper solder connections in semiconductor packages.
- Benefits:**
- Enhanced reliability in soldering processes - Improved connection quality between semiconductor packages and external devices
- Commercial Applications:**
This technology can be utilized in the production of consumer electronics, automotive electronics, and industrial equipment.
- Prior Art:**
Researchers can explore prior patents related to soldering processes in semiconductor packaging to gain more insights into this technology.
- Frequently Updated Research:**
Researchers are continually exploring new materials and techniques to enhance soldering processes in semiconductor packaging.
- Questions about Semiconductor Package with Dummy Solder:**
1. How does the dummy solder contribute to the soldering process in semiconductor packaging? 2. What are the potential challenges in implementing this technology in large-scale manufacturing processes?
Original Abstract Submitted
The present disclosure provides a semiconductor package having a dummy solder and a manufacturing method thereof. The solder bump array is disposed on one surface of the semiconductor package, and a dummy solder is disposed point-symmetrically about a center of the solder bump array. The solder bumps have a first melting point, and the dummy solder has a second melting point lower than the first melting point so that the dummy solder melts before the solder bumps to generate a force in a direction in which the solder bump contacts the connection terminal of the external device by surface tension in a soldering process.
