18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME
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WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18223788 titled 'WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME
The inventive concept provides an image sensor with a unique wafer-to-wafer bonding structure.
- The image sensor includes a first substrate with a pixel array, multilayer wiring, and insulation layers.
- A second substrate on top of the first substrate contains a logic circuit, multilayer wiring, and insulation layers.
- The bonding between the first and second substrates is achieved through symmetrical slope-shaped steps on their junction surfaces.
- Direct bonding is formed between the substrates due to the engagement of these steps.
Potential Applications: - This technology can be used in digital cameras, smartphones, and other electronic devices requiring high-quality image sensors. - It can also be applied in medical imaging equipment, surveillance cameras, and automotive cameras.
Problems Solved: - Provides a reliable and efficient bonding structure for image sensors. - Enhances the overall performance and durability of the image sensor.
Benefits: - Improved image sensor quality and functionality. - Enhanced durability and longevity of electronic devices using this technology.
Commercial Applications: Title: Advanced Image Sensor Technology for Electronic Devices This technology can be utilized in the consumer electronics industry, medical imaging sector, and security surveillance market. It offers a competitive edge to companies producing devices with high-quality image sensors.
Questions about Image Sensor Technology: 1. How does the slope-shaped step design improve the bonding structure of the image sensor?
- The slope-shaped steps on the junction surfaces of the substrates create a symmetrical engagement, ensuring a direct and strong bond between them.
2. What are the potential cost savings associated with implementing this innovative bonding structure in image sensors?
- The efficient bonding structure reduces the need for additional materials and processes, leading to cost savings in production.
Original Abstract Submitted
The inventive concept provides an image sensor including a step having a slope shape and an image sensor including the wafer-to-wafer bonding structure. The image sensor includes a first substrate including a pixel array, a first multilayer wiring, a first insulation layer formed on a first junction surface to pass through the first insulation layer and a second substrate on the first substrate, wherein the second substrate includes a logic circuit, a second multilayer wiring, a second insulation layer on a second junction surface opposite to the first junction surface and a second metal pad passing through the second insulation layer, and a second step formed in the second junction surface engages with a first step formed in the first junction surface in a symmetrical slope shape to form direct bonding between the first substrate and the second substrate.
