18223307. IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
JUNGHOON Kang of Suwon-si (KR)
UN-BYOUNG Kang of Suwon-si (KR)
SEUNGWAN Shin of Suwon-si (KR)
JUNG HYUN Lee of Suwon-si (KR)
IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18223307 titled 'IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
The image sensor package described in the patent application includes a substrate with a metal portion, an image sensor chip mounted on the substrate, and a transparent glass cover with an upper plate and sidewalls that form a cavity.
- The transparent glass cover is directly bonded to the metal portion of the substrate, sealing the image sensor chip and protecting it from external elements.
- The sidewalls of the glass cover are spaced from the image sensor chip, providing a protective barrier while allowing for optimal functionality.
- This design ensures the image sensor chip is securely enclosed and shielded, enhancing its performance and longevity.
- The use of a transparent glass cover allows for high-quality imaging with minimal interference or distortion.
- The direct bonding of the glass cover to the metal portion of the substrate improves the overall durability and reliability of the image sensor package.
Potential Applications: - This technology can be used in various digital imaging devices such as cameras, smartphones, and surveillance systems. - It can also be applied in medical imaging equipment, automotive cameras, and industrial inspection systems.
Problems Solved: - Protects the image sensor chip from damage, dust, and moisture. - Ensures high-quality imaging performance by minimizing interference and distortion. - Enhances the overall durability and reliability of the image sensor package.
Benefits: - Improved image sensor chip protection and longevity. - Enhanced image quality and performance. - Increased durability and reliability of imaging devices.
Commercial Applications: The technology can be utilized in the development of advanced digital cameras, smartphones, medical imaging devices, surveillance systems, automotive cameras, and industrial inspection equipment. The improved durability and image quality provided by this innovation can lead to enhanced consumer satisfaction and market competitiveness.
Questions about Image Sensor Package: 1. How does the direct bonding of the glass cover to the metal portion of the substrate benefit the image sensor chip? 2. What potential applications outside of consumer electronics could benefit from this technology?
Original Abstract Submitted
An image sensor package according to an embodiment includes: a substrate including a metal portion; an image sensor chip on the substrate; and a transparent glass cover disposed on the substrate and including an upper plate and sidewalls, the upper plate and the sidewalls defined by a cavity at a lower portion and spaced from the image sensor chip, wherein the sidewalls are directly bonded to the metal portion of the substrate, and the image sensor chip is sealed by the transparent glass cover and the substrate.
