18222087. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
Samsung Electro-Mechanics Co., Ltd.
Inventor(s)
Chung Yeol Lee of Suwon-si (KR)
Jong Rock Lee of Suwon-si (KR)
Hee Jung Jung of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18222087 titled 'MULTILAYER ELECTRONIC COMPONENT
The abstract of the patent application describes a multilayer electronic component with a body containing a dielectric layer and an internal electrode, as well as an external electrode with a base electrode layer, a first metal element, an alloy layer, and a plating layer.
- The external electrode includes a base electrode layer with a first metal element, an alloy layer with an alloy of the first metal element and Sn, and a second alloy layer with an alloy of Ni and Sn.
- The plating layer consists of an Ni plating layer in contact with the second alloy layer.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides improved conductivity and reliability in electronic components. - Enhances the performance and durability of electronic devices.
Benefits: - Increased efficiency and functionality of electronic components. - Extended lifespan of electronic devices. - Reduced maintenance and replacement costs.
Commercial Applications: - This technology can be utilized by electronic manufacturers to enhance the quality and performance of their products, leading to a competitive edge in the market.
Questions about the technology: 1. How does the alloy layer improve the performance of the external electrode? 2. What are the specific advantages of using an Ni plating layer in this multilayer electronic component?
Original Abstract Submitted
A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including a base electrode layer disposed on the body and including a first metal element, and an alloy layer and a plating layer, sequentially disposed on the base electrode layer. The alloy layer includes a first alloy layer disposed to contact the base electrode layer and including an alloy of the first metal element and Sn, and a second alloy layer disposed to contact the first alloy layer and including an alloy of Ni and Sn, and the plating layer includes an Ni plating layer disposed to contact the second alloy layer.
