18220053. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sang Cheon Park of Suwon-si (KR)
Young Kun Jee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18220053 titled 'SEMICONDUCTOR PACKAGE
The semiconductor chip stack structure described in the patent application consists of multiple first semiconductor chip dies stacked vertically, with one or more second semiconductor chip dies positioned between adjacent first semiconductor chip dies. The second semiconductor chip dies are thicker than the first semiconductor chip dies in the vertical direction.
- The innovation involves stacking semiconductor chip dies in a vertical direction with varying thicknesses to optimize performance and functionality.
- By incorporating thicker second semiconductor chip dies between the first semiconductor chip dies, the overall structure can achieve improved efficiency and processing power.
- This design allows for more complex circuitry and functionality within a compact space, enhancing the overall capabilities of the semiconductor chip stack structure.
Potential Applications:
- This technology can be applied in various electronic devices such as smartphones, tablets, and computers to enhance their performance and functionality.
- It can also be utilized in industrial applications where high processing power and efficiency are required.
Problems Solved:
- Addresses the challenge of maximizing performance and functionality in a limited space within semiconductor chip stack structures.
- Optimizes the design of stacked semiconductor chip dies to improve overall efficiency and processing power.
Benefits:
- Improved performance and functionality in electronic devices.
- Enhanced efficiency and processing power in industrial applications.
- Compact design with advanced capabilities.
Commercial Applications:
- The technology can be commercialized in the semiconductor industry for the development of high-performance electronic devices.
- It has potential applications in various sectors including telecommunications, automotive, and healthcare for advanced processing requirements.
Questions about Semiconductor Chip Stack Structure: 1. How does the thickness variation of semiconductor chip dies impact the overall performance of the stack structure? 2. What are the specific advantages of incorporating thicker second semiconductor chip dies in the vertical stack configuration?
Original Abstract Submitted
Provided is a semiconductor chip stack structure including a plurality of first semiconductor chip dies stacked in a vertical direction, and one or more second semiconductor chip dies between adjacent first semiconductor chip dies among the plurality of first semiconductor chip dies, wherein a thickness of each second semiconductor chip die of the one or more second semiconductor chip dies is greater than a thickness of each first semiconductor chip die of the plurality of first semiconductor chip dies in the vertical direction.
