18219697. SEMICONDUCTOR DEVICE HAVING COMMON SOURCE LINE LAYER, ELECTRONIC SYSTEM INCLUDING THE SAME, AND RELATED METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICE HAVING COMMON SOURCE LINE LAYER, ELECTRONIC SYSTEM INCLUDING THE SAME, AND RELATED METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

JIWON Kim of Suwon-si (KR)

Ahreum Lee of Suwon-si (KR)

JOONYOUNG Kwon of Suwon-si (KR)

Dohyung Kim of Suwon-si (KR)

JUNHYOUNG Kim of Suwon-si (KR)

SUKKANG Sung of Suwon-si (KR)

SEMICONDUCTOR DEVICE HAVING COMMON SOURCE LINE LAYER, ELECTRONIC SYSTEM INCLUDING THE SAME, AND RELATED METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18219697 titled 'SEMICONDUCTOR DEVICE HAVING COMMON SOURCE LINE LAYER, ELECTRONIC SYSTEM INCLUDING THE SAME, AND RELATED METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract includes a cell region with a channel structure and memory cells arranged in three dimensions, along with various contact regions and layers connecting them.

  • Memory cells are arranged in three dimensions within the cell region.
  • Different contact regions include cell contact, common source line contact, and input and output contact regions.
  • A word line cut region separates word lines of different cell regions.
  • A common source line layer connects the channel structure and the common source line contact plug.
  • An input and output pad is connected to the input and output contact plug.
  • The common source line layer and the input and output pad are at the same vertical level.

Potential Applications: - This semiconductor device can be used in various memory applications, such as flash memory or DRAM. - It can also be utilized in logic circuits and microprocessors.

Problems Solved: - Provides a compact and efficient design for semiconductor devices with memory cells arranged in three dimensions. - Ensures proper connectivity between different regions of the device.

Benefits: - Improved performance and efficiency in memory applications. - Enhanced connectivity and functionality in semiconductor devices.

Commercial Applications: - This technology can be valuable in the semiconductor industry for developing advanced memory devices and logic circuits. - It can also have applications in consumer electronics, data storage, and computing devices.

Questions about the technology: 1. How does the three-dimensional arrangement of memory cells benefit the overall performance of the semiconductor device? 2. What are the specific advantages of having the common source line layer and input and output pad at the same vertical level in the device design?


Original Abstract Submitted

A semiconductor device includes a cell region in which a channel structure is disposed and memory cells arranged in three dimensions are disposed, a cell contact region in which a cell contact plug is disposed, a common source line contact region in which a common source line contact plug is disposed, an input and output contact region in which an input and output contact plug is disposed, a word line cut region separating word lines of the cell region from word lines of a neighboring cell region, a common source line layer connecting the channel structure and the common source line contact plug, and an input and output pad connected to the input and output contact plug. The common source line layer and the input and output pad are disposed at the same vertical level.