18218322. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
Youngdeuk Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18218322 titled 'SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor chip with multiple second semiconductor chips stacked on top, temperature sensors on the upper surface of the chips, and a thermal conductive member covering the sensors.
- The semiconductor package consists of a first semiconductor chip and multiple second semiconductor chips stacked on top of each other.
- Temperature sensors are placed on the upper surface of the chips, with at least one in the central region of the uppermost chip and multiple in the peripheral region.
- A thermal conductive member is provided on the uppermost chip, covering both the central and peripheral temperature sensors.
Potential Applications
The technology described in this patent application could be applied in various industries such as:
- Semiconductor manufacturing
- Electronics
- Automotive
Problems Solved
This technology addresses several issues in semiconductor packaging, including:
- Monitoring temperature variations in different regions of the stacked chips
- Ensuring efficient heat dissipation
- Improving overall performance and reliability of the semiconductor package
Benefits
The benefits of this technology include:
- Enhanced thermal management
- Improved accuracy in temperature monitoring
- Increased reliability and longevity of semiconductor devices
Potential Commercial Applications
With its improved thermal management and temperature monitoring capabilities, this technology could find commercial applications in:
- High-performance computing
- Data centers
- Aerospace industry
Possible Prior Art
One possible prior art related to this technology is the use of thermal conductive materials in semiconductor packaging to improve heat dissipation and thermal performance.
Unanswered Questions
How does the placement of temperature sensors impact the overall performance of the semiconductor package?
The abstract mentions temperature sensors in both the central and peripheral regions of the uppermost chip, but it does not elaborate on the specific reasons for this placement.
What are the specific materials used in the thermal conductive member, and how do they contribute to heat dissipation?
While the abstract mentions the presence of a thermal conductive member, it does not provide details on the materials used or how they enhance heat dissipation.
Original Abstract Submitted
A semiconductor package includes: a first semiconductor chip; a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, the plurality of second semiconductor chips including an uppermost semiconductor chip including a central region and a peripheral region at a periphery of the central region; at least one first temperature sensor provided on an upper surface of the uppermost semiconductor chip in the central region; a plurality of second temperature sensors provided on the upper surface in the peripheral region; and a thermal conductive member provided on the uppermost semiconductor chip and covering the at least one first temperature sensor and the plurality of second temperature sensors.
