18216157. SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS simplified abstract (Samsung Electronics Co., Ltd.)

SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Sanghyuck Oh of Suwon-si (KR)

Seonghoon Bae of Suwon-si (KR)

Kwangok Jeong of Suwon-si (KR)

SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18216157 titled 'SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS

Simplified Explanation

The semiconductor package described in the abstract includes a lower redistribution structure with an insulating layer, a connection pad, and an upper pad, a semiconductor chip mounted on the lower redistribution structure, a conductive post, at least one dummy post, and an upper redistribution structure connected to the semiconductor chip.

• Lower redistribution structure:

   - Insulating layer
   - Connection pad
   - Upper pad

• Semiconductor chip mounted on lower redistribution structure and connected to upper pad

• Conductive post on connection pad

• At least one dummy post on lower redistribution structure

• Upper redistribution structure connected to semiconductor chip

• Height of dummy post is smaller than height of conductive post

Potential Applications

The technology described in the patent application could be applied in various semiconductor packaging applications where precise connections and efficient heat dissipation are required.

Problems Solved

This technology solves the problem of ensuring proper connections and heat dissipation in semiconductor packages, improving overall performance and reliability.

Benefits

The benefits of this technology include improved electrical connections, enhanced thermal management, and increased overall efficiency of semiconductor devices.

Potential Commercial Applications

The technology could be utilized in the manufacturing of advanced electronic devices, such as smartphones, tablets, computers, and other consumer electronics, to improve their performance and reliability.

Possible Prior Art

One possible prior art could be the use of dummy posts in semiconductor packaging to improve thermal management and electrical connections. However, the specific configuration and arrangement of components in this patent application may be unique.

How does this technology compare to existing semiconductor packaging solutions in terms of cost-effectiveness and performance?

This article does not provide a direct comparison between this technology and existing semiconductor packaging solutions in terms of cost-effectiveness and performance. Further research or analysis would be needed to address this question.

What are the potential challenges or limitations of implementing this technology in mass production?

The article does not discuss the potential challenges or limitations of implementing this technology in mass production. Factors such as scalability, manufacturing complexity, and compatibility with existing production processes could be important considerations.

Original Abstract Submitted

A semiconductor package according to an example embodiment of the present disclosure comprises: a lower redistribution structure including an insulating layer, a connection pad disposed on an upper surface of the insulating layer, and an upper pad; a semiconductor chip mounted on the lower redistribution structure and connected to the upper pad; a conductive post disposed on the connection pad; at least one dummy post disposed on the lower redistribution structure; and an upper redistribution structure disposed on the semiconductor chip and connected to the conductive post, and a height of the at least one dummy post is smaller than a height of the conductive post.