18216049. FAN MODULES FOR ELECTRONIC DEVICES (Intel Corporation)

FAN MODULES FOR ELECTRONIC DEVICES

Organization Name

Intel Corporation

Inventor(s)

Jeff Ku of Taipei (TW)

Nirmala Bailur of Bangalore (IN)

Min Suet Lim of Gelugor (MY)

Tongyan Zhai of Portland OR (US)

Chee Chun Yee of Bayan Lepas (MY)

Ruander Cardenas of Hillsboro OR (US)

Lance Lin of Taipei (TW)

Eng Huat Goh of Paya Terubong (MY)

Javed Shaikh of Bengaluru (IN)

Jun Liao of Portland OR (US)

Kavitha Nagarajan of Bangalore (IN)

Tin Poay Chuah of Bayan Baru (MY)

Martin M. Chang of Beaverton OR (US)

Shantanu D. Kulkarni of Hillsboro OR (US)

Telesphor Kamgaing of Chandler AZ (US)

FAN MODULES FOR ELECTRONIC DEVICES

This abstract first appeared for US patent application 18216049 titled 'FAN MODULES FOR ELECTRONIC DEVICES

Original Abstract Submitted

Systems, apparatus, articles of manufacture, and methods are disclosed for cooling electronic devices. An example apparatus includes a fan module for an electronic device. The fan module includes a first cover; a second cover; an input/output (IO) board adjacent the second cover, the second cover and IO board beneath the first cover; and a fan between the first cover and the second cover, the fan to operate above the second cover and a portion of the IO board.