18215292. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18215292 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a lower redistribution wiring layer and a first semiconductor device connected to the lower redistribution wiring layer via conductive bumps. The lower redistribution wiring layer consists of a first redistribution wire in a first lower insulating layer, an insulating structure layer with an opening exposing a portion of the first redistribution wire, a second redistribution wire in the opening of the insulating structure layer, and bonding pads connected to the second redistribution wire.
- Lower redistribution wiring layer with first and second redistribution wires
- Insulating structure layer with opening exposing redistribution wires
- Bonding pads connected to redistribution wires
Potential Applications
This technology can be applied in the manufacturing of advanced semiconductor packages for various electronic devices such as smartphones, tablets, and computers.
Problems Solved
This technology solves the problem of efficiently connecting semiconductor devices to redistribution wiring layers in a compact and reliable manner.
Benefits
The benefits of this technology include improved electrical connectivity, reduced signal interference, and enhanced overall performance of semiconductor packages.
Potential Commercial Applications
This technology has potential commercial applications in the semiconductor industry for the production of high-performance electronic devices with compact and reliable packaging.
Possible Prior Art
Prior art in semiconductor packaging technologies may include methods for connecting semiconductor devices to redistribution wiring layers using conductive bumps and insulating layers.
What are the specific materials used in the insulating structure layer?
The specific materials used in the insulating structure layer include photosensitive insulating layers, a light blocking layer, and redistribution vias.
How does this technology compare to traditional semiconductor packaging methods?
This technology offers improved efficiency and reliability in connecting semiconductor devices to redistribution wiring layers compared to traditional methods.
Original Abstract Submitted
A semiconductor package includes a lower redistribution wiring layer; and a first semiconductor device on the lower redistribution wiring layer, the first semiconductor device being connected to the lower redistribution wiring layer via conductive bumps, wherein the lower redistribution wiring layer includes: a first redistribution wire in a first lower insulating layer; an insulating structure layer having an opening that exposes a portion of the first redistribution wire, the insulating structure layer including a first photosensitive insulating layer, a light blocking layer on the first photosensitive insulating layer, and a second photosensitive insulating layer on the light blocking layer; a second redistribution wire in the opening of the insulating structure layer, the second redistribution wire including a redistribution via contacting the first redistribution wire, and a redistribution line stacked on the redistribution via; and bonding pads bonded to the conductive bumps and electrically connected to the second redistribution wire.
