18214857. CONDITIONER AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 CONDITIONER AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CONDITIONER AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CONDITIONER AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME
Organization Name
Inventor(s)
Donghoon Kwon of Suwon-si (KR)
CONDITIONER AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18214857 titled 'CONDITIONER AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME
Simplified Explanation
The patent application describes a conditioner for chemically mechanically polishing a substrate using slurry, with features such as a conditioning arm, conditioning disk, dilution solution injector, and sonicator.
- The conditioner includes a conditioning arm attached to a polishing pad.
- A conditioning disk on the arm is used to condition the polishing pad.
- A dilution solution injector injects a dilution solution into the slurry under the conditioning disk.
- A sonicator applies ultrasonic waves to debris generated from the polishing pad.
Potential Applications
The technology can be applied in the semiconductor industry for polishing silicon wafers.
Problems Solved
The conditioner helps improve the efficiency and quality of substrate polishing processes.
Benefits
- Enhanced polishing performance - Increased productivity - Improved substrate surface quality
Potential Commercial Applications
"Advanced Conditioner for Substrate Polishing in Semiconductor Industry"
Possible Prior Art
There are similar conditioners in the market that use different methods for substrate polishing.
Unanswered Questions
How does the ultrasonic wave affect debris removal?
The ultrasonic wave helps to dislodge debris from the polishing pad, but the exact mechanism of this action is not detailed in the abstract.
What is the specific composition of the dilution solution?
The abstract mentions a dilution solution, but the exact composition or properties of this solution are not provided.
Original Abstract Submitted
Provided is a conditioner including a conditioning arm on a polishing pad that is configured to chemically mechanically polish a substrate based on slurry, a conditioning disk on the conditioning arm that is configured to condition the polishing pad, a dilution solution injector on a first side of the conditioning arm and configured to inject a dilution solution to the slurry introduced into a space under the conditioning disk, and a sonicator on a second side of the conditioning arm and configured to apply an ultrasonic wave to debris generated from the polishing pad.
