18214808. METHOD OF MANUFACTURING MICRO-LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING DISPLAY APPARATUS BY USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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METHOD OF MANUFACTURING MICRO-LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING DISPLAY APPARATUS BY USING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Dongho Kim of Suwon-si (KR)

Howon Jang of Seoul (KR)

Jehong Oh of Uiwang-si (KR)

Kyungwook Hwang of Suwon-si (KR)

Junsik Hwang of Suwon-si (KR)

METHOD OF MANUFACTURING MICRO-LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING DISPLAY APPARATUS BY USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18214808 titled 'METHOD OF MANUFACTURING MICRO-LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING DISPLAY APPARATUS BY USING THE SAME

Simplified Explanation

The patent application describes a method of manufacturing a micro-LED and a display apparatus using this method. Here are the key points:

  • A membrane with a cavity is formed on a substrate.
  • A sacrificial layer is formed on the membrane, which can be selectively removed by wet etching.
  • A light-emitting device is formed on the sacrificial layer.
  • The light-emitting device is separated from the membrane by wet etching.
  • An undoped semiconductor layer may be formed between the membrane and the sacrificial layer.
  • The sacrificial layer may have the same crystal lattice structure as the undoped semiconductor layer.
  • Another undoped semiconductor layer may be formed between the sacrificial layer and the light-emitting device.

Potential applications of this technology:

  • Manufacturing micro-LEDs for display panels and screens.
  • Creating high-resolution and energy-efficient displays for smartphones, televisions, and other electronic devices.

Problems solved by this technology:

  • Enables the manufacturing of micro-LEDs with improved efficiency and performance.
  • Provides a method for separating the light-emitting device from the substrate without damaging it.
  • Allows for the formation of multiple undoped semiconductor layers, enhancing the functionality of the micro-LED.

Benefits of this technology:

  • Improved energy efficiency and brightness of micro-LED displays.
  • Higher resolution and pixel density for sharper and more detailed images.
  • Enhanced durability and longevity of micro-LED devices.
  • Potential for flexible and curved displays due to the use of membranes.


Original Abstract Submitted

Provided are a method of manufacturing a micro-LED and a method of manufacturing a display apparatus to which the method is applied. In the method of manufacturing a micro-LED, a membrane formed to include a cavity is formed on a substrate, and then, a sacrificial layer that may be selectively removed by wet etching is formed on the membrane. Next, a light-emitting device is formed on the sacrificial layer, and the light-emitting device is separated from the membrane by the wet etching. In an example, an undoped semiconductor layer may further be formed between the membrane and the sacrificial layer. The sacrificial layer may include an oxide layer having the same crystal lattice structure as that of the undoped semiconductor layer. In an example, another undoped semiconductor layer may further be formed between the sacrificial layer and the light-emitting device.