18214341. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Shanghoon Seo of Suwon-si (KR)
Hyeonjeong Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18214341 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a complex structure involving multiple semiconductor devices, redistribution structures, vertical connection conductors, molding layers, heat dissipation components, and more.
- First redistribution structure
- First semiconductor device mounted on the first redistribution structure
- Molding layer surrounding the first semiconductor device
- Second redistribution structure on the molding layer and first semiconductor device
- Vertical connection conductors in the molding layer connecting the redistribution patterns
- Second semiconductor device mounted on the second redistribution structure
- Heat dissipation pad structure contacting the upper surface of the first semiconductor device
- Heat dissipation plate spaced apart from the second semiconductor device along a horizontal direction
Potential Applications
The technology described in this patent application could be applied in various electronic devices requiring efficient heat dissipation and complex semiconductor packaging.
Problems Solved
This technology solves the problem of heat dissipation in densely packed semiconductor devices while also providing a reliable vertical connection between different semiconductor components.
Benefits
The benefits of this technology include improved thermal management, compact design, reliable electrical connections, and potentially enhanced performance of electronic devices.
Potential Commercial Applications
Potential commercial applications of this technology could include high-performance computing systems, data centers, telecommunications equipment, and other electronics requiring advanced semiconductor packaging solutions.
Possible Prior Art
One possible prior art for this technology could be the use of heat dissipation structures in semiconductor packages to improve thermal management and performance.
Unanswered Questions
How does this technology compare to traditional semiconductor packaging methods in terms of cost and complexity?
This article does not provide information on the cost and complexity comparison between this technology and traditional semiconductor packaging methods.
What specific materials are used in the heat dissipation components of this semiconductor package?
The article does not specify the materials used in the heat dissipation components of this semiconductor package.
Original Abstract Submitted
A semiconductor package includes a first redistribution structure, a first semiconductor device mounted on the first redistribution structure, a molding layer surrounding the first semiconductor device, a second redistribution structure disposed on the molding layer and the first semiconductor device, a plurality of vertical connection conductors vertically extending in the molding layer and electrically connecting the first redistribution pattern to the second redistribution pattern, a second semiconductor device mounted on the second redistribution structure, the second semiconductor device and the first semiconductor device vertically and partially overlapping each other, a heat dissipation pad structure contacting an upper surface of the first semiconductor device, and a heat dissipation plate disposed on the heat dissipation pad structure and spaced apart from the second semiconductor device along a first straight line extending in a horizontal direction that is parallel to the upper surface of the first semiconductor device.
