18214102. CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

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CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR COMPONENT

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Jae Hoon Kim of Suwon-si (KR)

Hye Jin Kim of Suwon-si (KR)

Gyoung Heon Ko of Suwon-si (KR)

Jang Won Lee of Suwon-si (KR)

CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18214102 titled 'CAPACITOR COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING CAPACITOR COMPONENT

The capacitor component described in the patent application consists of a support member with capacitance laminates on one surface, separated by insulating layers, and multiple through structures penetrating the laminates.

  • The capacitance laminates each contain a first electrode layer, a second electrode layer, and a dielectric layer in between.
  • Some of the through structures include connection conductive pillars linking first electrode layers, while others have a first conductive pillar connected to one electrode layer, surrounded by a dielectric through portion and a through connection portion connecting second electrode layers.

Potential Applications: - This technology can be used in electronic devices requiring capacitors for energy storage and signal filtering. - It can be applied in power supplies, audio equipment, and communication devices.

Problems Solved: - Provides a compact and efficient way to integrate capacitors into electronic circuits. - Enhances the performance and reliability of electronic devices by improving capacitor connectivity.

Benefits: - Increased energy storage capacity in a smaller footprint. - Enhanced signal filtering capabilities for improved device performance. - Simplified manufacturing processes for electronic components.

Commercial Applications: Capacitor manufacturers can utilize this technology to create more advanced and compact capacitors for various electronic applications, potentially leading to improved product performance and reliability.

Questions about Capacitor Component Technology: 1. How does this capacitor component technology compare to traditional capacitor designs?

  - This technology offers a more compact and efficient solution for integrating capacitors into electronic devices, improving performance and reliability.

2. What are the potential cost implications of implementing this technology in electronic devices?

  - While initial manufacturing costs may be higher, the long-term benefits of improved performance and reliability may outweigh the initial investment.


Original Abstract Submitted

A capacitor component includes a support member; capacitance laminates laminated on one surface of the support member; at least one insulating layer disposed between the capacitance laminates; and a plurality of through structures each penetrating through at least one of the capacitance laminates. Each of the capacitance laminates includes a first electrode layer, a second electrode layer, and a dielectric layer disposed between the first and second electrode layers. One of the plurality of through structures includes a connection conductive pillar connected between first electrode layers of the capacitance laminates. Another of the plurality of through structures includes a first conductive pillar connected to a first electrode layer of one of the capacitance laminates, a dielectric through portion surrounding the first conductive pillar; and a through connection portion surrounding the dielectric through portion and connecting second electrode layers of the capacitance laminates to each other.