18213852. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
UN-BYOUNG Kang of Suwon-si (KR)
SANG-SICK Park of Suwon-si (KR)
Seungyoon Jung of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18213852 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The semiconductor package described in the patent application consists of multiple semiconductor chips stacked on top of each other with adhesion layers in between. The lower adhesion layer has a cutting surface connected to its top surface, while the upper adhesion layer is in contact with this cutting surface.
- The semiconductor package includes a first semiconductor chip, a lower adhesion layer, a second semiconductor chip, an upper adhesion layer, and a third semiconductor chip stacked on top of each other.
- The lower adhesion layer has a cutting surface connected to its top surface, which plays a crucial role in the stacking of the semiconductor chips.
- The upper adhesion layer is in contact with the cutting surface of the lower adhesion layer, ensuring proper adhesion and stability of the stacked chips.
Potential Applications
The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics requiring compact and efficient semiconductor packaging.
Problems Solved
This technology solves the problem of efficiently stacking multiple semiconductor chips in a compact package while ensuring proper adhesion and stability between the chips.
Benefits
The benefits of this technology include increased packaging density, improved thermal performance, enhanced electrical connectivity, and overall reliability of the semiconductor package.
Potential Commercial Applications
The semiconductor packaging technology described in this patent application could find commercial applications in the semiconductor industry for manufacturing advanced electronic devices with higher performance and reliability.
Possible Prior Art
One possible prior art in semiconductor packaging technology is the use of wire bonding or flip-chip bonding techniques to connect multiple semiconductor chips in a package. These techniques may not provide the same level of compactness and efficiency as the stacked chip configuration described in this patent application.
Unanswered Questions
How does the cutting surface of the lower adhesion layer facilitate the stacking of semiconductor chips in the package?
The cutting surface of the lower adhesion layer plays a crucial role in ensuring proper alignment and adhesion between the stacked semiconductor chips. However, the specific mechanism or process by which this cutting surface facilitates the stacking of chips is not explicitly explained in the abstract.
What are the potential challenges or limitations of implementing this semiconductor packaging technology in mass production?
While the benefits of this technology are highlighted in the abstract, the potential challenges or limitations of implementing this semiconductor packaging technology in mass production are not addressed. Factors such as cost, scalability, and compatibility with existing manufacturing processes could be important considerations in commercializing this technology.
Original Abstract Submitted
Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a first semiconductor chip, a lower adhesion layer on the first semiconductor chip, a second semiconductor chip on the lower adhesion layer, an upper adhesion layer on the second semiconductor chip, and a third semiconductor chip on the upper adhesion layer. The lower adhesion layer includes a first cutting surface connected to a top surface of the lower adhesion layer. The upper adhesion layer is in contact with the first cutting surface of the lower adhesion layer.
