18213002. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Hyun Sik Chae of Suwon-si (KR)
Dong Jun Jung of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18213002 titled 'MULTILAYER ELECTRONIC COMPONENT
The multilayer electronic component described in the patent application consists of a body with internal electrodes and a dielectric layer sandwiched between them, with various surfaces and side margin portions.
- The body of the component has first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces, with side margin portions located on the fifth and sixth surfaces.
- External electrodes are positioned on the third and fourth surfaces of the body.
- Each side margin portion includes a first region near the internal electrodes and a second region towards the outside of the side margin portion.
- The average Sn amount (tin content) in the first region is lower than in the second region, with the Sn amount gradually increasing from the internal electrodes towards the second region.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - The technology addresses the need for efficient and reliable multilayer electronic components with improved performance.
Benefits: - Enhanced reliability and performance of electronic devices. - Improved manufacturing processes for electronic components. - Potential cost savings in production.
Commercial Applications: Title: Advanced Multilayer Electronic Components for Enhanced Device Performance This technology can be utilized by electronic manufacturers to enhance the performance and reliability of their products, leading to increased customer satisfaction and market competitiveness.
Questions about Multilayer Electronic Components: 1. How does the tin content in the side margin portions affect the overall performance of the electronic component? - The tin content in the side margin portions plays a crucial role in ensuring the reliability and functionality of the component by facilitating proper electrical connections and reducing potential defects.
2. What are the key factors to consider when designing multilayer electronic components for specific applications? - Design considerations for multilayer electronic components include material selection, electrode placement, and overall component layout to meet the requirements of the intended application.
Original Abstract Submitted
A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed in a first direction with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces. Each of the side margin portions includes a first region adjacent to the internal electrodes, and a second region adjacent to an outside of each of the side margin portions. An average Sn amount of the first region is lower than an average Sn amount of the second region. An Sn amount of the first region gradually increases from a side of the internal electrodes to the second region.
