18212867. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

PRINTED CIRCUIT BOARD

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Hyun Woo Kwon of Suwon-si (KR)

Jong Eun Park of Suwon-si (KR)

PRINTED CIRCUIT BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18212867 titled 'PRINTED CIRCUIT BOARD

The patent application describes a printed circuit board with multiple insulating layers of varying thicknesses.

• The circuit board includes a first substrate portion with three insulating layers stacked on top of each other.
• A second substrate portion is placed on top of the first substrate portion, with a fine insulating layer as a build-up layer.
• The thickness of the insulating layers decreases sequentially, with the fine insulating layer being thinner than the third insulating layer.

Potential Applications: - Electronic devices - Communication systems - Automotive industry

Problems Solved: - Improved signal transmission - Enhanced durability - Space-saving design

Benefits: - Increased efficiency - Enhanced performance - Cost-effective manufacturing

Commercial Applications: Title: Advanced Printed Circuit Boards for High-Performance Electronics This technology can be used in various industries such as telecommunications, aerospace, and medical devices. The market implications include faster and more reliable electronic systems.

Questions about the technology: 1. How does the varying thickness of insulating layers impact the performance of the circuit board? - The varying thickness helps in reducing signal interference and improving overall efficiency. 2. What are the potential cost savings associated with using this advanced circuit board technology? - The reduced material usage and improved performance can lead to cost savings in manufacturing processes.

Original Abstract Submitted

A printed circuit board includes a first substrate portion including a first insulating layer, a second insulating layer disposed on the first insulating layer, and a third insulating layer disposed on the second insulating layer; and a second substrate portion disposed on the first substrate portion and including a first fine insulating layer as a build-up insulating layer on an uppermost side of the first substrate portion and the second substrate portion. A thickness of the first insulating layer, a thickness of the second insulating layer, and a thickness of the third insulating layer are sequentially reduced. A thickness of the first fine insulating layer is lower than the thickness of the third insulating layer.