18209616. PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Mi Jeong Jeon of Suwon-si (KR)
Hyun Seok Yang of Suwon-si (KR)
Chan Jin Park of Suwon-si (KR)
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18209616 titled 'PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
The abstract describes a printed circuit board with a first insulating layer, a first metal layer with an oxidation region, and a second metal layer on top. The method of manufacturing involves forming the metal layers, oxidizing a portion to create the oxidation region, and removing part of it.
- Simplified Explanation:
- The patent application is for a printed circuit board with specific layers and oxidation regions. - The method of manufacturing involves forming metal layers, oxidizing part of it, and removing the oxidation region.
- Key Features and Innovation:
- Printed circuit board with a unique metal layer structure. - Method of manufacturing involves oxidation to create specific regions. - Improved design for circuit boards.
- Potential Applications:
- Electronics manufacturing. - Circuit board production. - Technology industry.
- Problems Solved:
- Enhancing circuit board performance. - Improving manufacturing processes. - Creating more efficient electronic devices.
- Benefits:
- Higher quality circuit boards. - Increased functionality. - Potential cost savings in production.
- Commercial Applications:
- Potential use in consumer electronics. - Industrial applications in manufacturing. - Integration into various electronic devices.
- Questions about Printed Circuit Board Technology:
1. How does the oxidation region impact the performance of the circuit board? 2. What are the specific advantages of the unique metal layer structure in this technology?
- Frequently Updated Research:
- Stay updated on advancements in printed circuit board technology. - Monitor developments in metal layer manufacturing processes.
Original Abstract Submitted
A printed circuit board includes a first insulating layer, a first metal layer disposed on the first insulating layer and including a first oxidation region on a side surface thereof, and a second metal layer disposed on the first metal layer. A method of manufacturing a printed circuit board includes forming a first metal layer on a first insulating layer, forming a second metal layer on a portion of the first metal layer, oxidizing another portion of the first metal layer to form a first oxidation region, and removing at least a portion of the first oxidation region.
