18209434. THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS (Intel Corporation)
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THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS
Organization Name
Inventor(s)
Daniel Christensen of Portland OR (US)
Daniel Pantuso of Portland OR (US)
Kambiz Komeyli of Portland OR (US)
Jeffrey Hicks of Banks OR (US)
Manjunath Shamanna of Austin TX (US)
THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS
This abstract first appeared for US patent application 18209434 titled 'THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS
Original Abstract Submitted
Disclosed is an integrated circuit with a metallization stack that has thermal tower assemblages formed from wires in two or more metal layers to assist in dissipating heat out of the metallization stack.
