18208415. REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE simplified abstract (Samsung Electronics Co., Ltd.)
REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE
Organization Name
Inventor(s)
Hyungjun Park of Suwon-si (KR)
Seong-Hoon Bae of Suwon-si (KR)
Sang-Hyuck Oh of Suwon-si (KR)
Kwangok Jeong of Suwon-si (KR)
REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18208415 titled 'REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE
The patent application describes a redistribution substrate with multiple layers and a wiring pattern that includes a via portion and a pad portion.
- The substrate includes first and second insulating layers, a wiring layer, and a metal layer.
- The wiring pattern has a via portion penetrating the first insulating layer and a pad portion on the via portion.
- The metal layer covers the upper surface of the wiring pattern, with a concentration of metal varying in different portions.
- The second insulating layer covers the pad portion and the metal layer, providing additional protection and insulation.
- The metal layer includes a first metal and a second metal, with different concentrations in different portions of the layer.
Potential Applications: - This technology could be used in semiconductor devices and integrated circuits. - It may find applications in electronic packaging and interconnects in various electronic devices.
Problems Solved: - Provides improved electrical connectivity and insulation in complex electronic systems. - Enhances the reliability and performance of semiconductor devices.
Benefits: - Increased efficiency and reliability of electronic components. - Better thermal management and signal integrity in high-performance devices.
Commercial Applications: - This technology could be valuable in the semiconductor industry for manufacturing advanced electronic devices. - It may also have applications in telecommunications, consumer electronics, and automotive electronics.
Questions about the Technology: 1. How does the concentration of metal in different portions of the metal layer affect the performance of the substrate? 2. What are the specific advantages of using a redistribution substrate with multiple insulating layers in electronic devices?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging and interconnect technologies to understand the evolving landscape of this field.
Original Abstract Submitted
A redistribution substrate includes first and second insulating layers; a wiring layer, and a metal layer. The wiring pattern includes a via portion penetrating the first insulating layer and a pad portion on the via portion, the pad portion extending onto an upper surface of the first insulating layer. The metal layer covers an upper surface of the wiring pattern. The second insulating layer is provided on the first insulating layer and covers the pad portion and the metal layer. The wiring pattern includes a first metal. The metal layer includes the first metal and a second metal. The metal layer includes a first portion vertically overlapping the pad portion, and a second portion surrounding the first portion, and a concentration of the first metal in the first portion of the metal layer is greater than a concentration of the first metal in the second portion of the metal layer.
