18206472. SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE
Organization Name
Inventor(s)
Sungchan Kang of Suwon-si (KR)
SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18206472 titled 'SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE
The semiconductor device described in the abstract includes a semiconductor chip with an integrated circuit, a cooling channel to provide coolant for cooling the chip, and flexible capillary patterns inside the cooling channel to move the coolant by capillary action.
- The semiconductor device features flexible capillary patterns that can move coolant through capillary action.
- Each capillary pattern has a first portion supported by the chip's surface and a second portion that changes curvature based on temperature.
- The cooling channel is designed to efficiently cool the semiconductor chip during operation.
Potential Applications:
- This technology can be applied in high-performance computing systems, data centers, and other electronics requiring efficient cooling solutions.
- It can also be used in automotive electronics, aerospace applications, and medical devices where thermal management is critical.
Problems Solved:
- Addresses the challenge of efficiently cooling semiconductor chips to prevent overheating and ensure optimal performance.
- Provides a solution for managing heat dissipation in compact electronic devices with limited space for traditional cooling systems.
Benefits:
- Improved thermal management and enhanced performance of semiconductor devices.
- Increased reliability and longevity of electronic components.
- Energy efficiency and reduced operating costs in electronic systems.
Commercial Applications:
- Title: "Advanced Thermal Management Solutions for Electronics Industry"
- This technology can be commercialized by semiconductor manufacturers, electronics companies, and cooling system providers.
- It has the potential to disrupt the thermal management market and drive innovation in electronic device design.
Questions about the technology: 1. How does the curvature of the capillary patterns change based on temperature? 2. What are the specific benefits of using capillary action for coolant movement in semiconductor devices?
Original Abstract Submitted
A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit; a cooling channel including a surface of the semiconductor chip and configured to provide a passage for a coolant to cool the semiconductor chip; and a plurality of flexible capillary patterns on the surface of the semiconductor chip inside the cooling channel and configured to move the coolant by capillary action, wherein each capillary pattern of the plurality of flexible capillary patterns may include a first portion in a length direction of the capillary pattern that contacts and is supported by the surface of the semiconductor chip, and a second portion in the length direction that is spaced apart from and unsupported by the surface of the semiconductor chip, and a curvature of the second portion of each capillary pattern of the plurality of flexible capillary patterns changes according to temperature.
