18206443. DIFFERENTIAL SUBSTRATE BACKSIDE COOLING simplified abstract (Applied Materials, Inc.)
Contents
DIFFERENTIAL SUBSTRATE BACKSIDE COOLING
Organization Name
Inventor(s)
Yogananda Sarode Vishwanath of Bangalore (IN)
DIFFERENTIAL SUBSTRATE BACKSIDE COOLING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18206443 titled 'DIFFERENTIAL SUBSTRATE BACKSIDE COOLING
Simplified Explanation: The patent application describes an electrostatic chuck (ESC) with a ceramic body that has embedded electrodes and is designed to retain substrates using gas pressure and electrostatic forces.
Key Features and Innovation:
- Ceramic body with embedded electrodes
- Three or more concentric regions on the surface
- Retaining rings and supportive structures in each region
- Conduits for introducing gas into each region independently
- Positive gas pressure retention in each region
- Electrodes generating retaining force on the substrate surface
Potential Applications: The technology can be used in semiconductor manufacturing, flat panel display production, and other industries requiring precise substrate handling.
Problems Solved: The ESC addresses the need for secure and stable substrate retention during manufacturing processes that require high precision.
Benefits:
- Improved substrate handling and positioning
- Enhanced manufacturing efficiency and yield
- Reduced risk of substrate damage during processing
Commercial Applications: Potential commercial applications include semiconductor fabrication, LED production, and solar panel manufacturing, where precise substrate control is essential for quality and yield optimization.
Prior Art: Readers can explore prior art related to electrostatic chucks, ceramic chuck designs, and substrate handling technologies in semiconductor and display manufacturing.
Frequently Updated Research: Stay informed about the latest developments in electrostatic chuck technology, ceramic materials research, and advancements in substrate handling techniques.
Questions about Electrostatic Chuck Technology: 1. What are the key advantages of using an electrostatic chuck in semiconductor manufacturing? 2. How does the design of the ceramic body impact the performance of the electrostatic chuck?
Original Abstract Submitted
An electrostatic chuck (ESC) having a ceramic body including embedded electrodes and having a first diameter. Three or more regions are defined on a surface and arranged concentrically on the surface, each region includes a retaining ring arranged on the surface and defining an outer edge of the region, and supportive structures arranged on the surface and within the region. The supportive structures are configured to support a surface of a substrate when the substrate is retained by the ESC. The ESC includes conduits formed in the ceramic body and configured to independently introduce a gas into each region through the ceramic body and to the first surface. Each region is configured to retain a corresponding positive gas pressure within the region and the surface of the substrate, and the one or more embedded electrodes are configured to generate a retaining force on the surface of the substrate.
