18204970. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 What materials are used in the heat dissipation member?
- 1.11 How does the encapsulant affect the overall performance of the semiconductor package?
- 1.12 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sangwoong Lee of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18204970 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a first redistribution structure, a first semiconductor chip, an encapsulant, first conductive posts, a heat dissipation member, and a second semiconductor chip. The first semiconductor chip overlaps the first conductive posts in one direction, while the second semiconductor chip does not overlap the first semiconductor chip in that direction.
- The semiconductor package includes a first redistribution structure, a first semiconductor chip, an encapsulant, first conductive posts, a heat dissipation member, and a second semiconductor chip.
- The first semiconductor chip overlaps the first conductive posts in one direction, while the second semiconductor chip does not overlap the first semiconductor chip in that direction.
Potential Applications
This technology could be applied in:
- High-performance computing
- Automotive electronics
- Telecommunications
Problems Solved
This technology helps to:
- Improve heat dissipation in semiconductor packages
- Enhance electrical connectivity between components
- Increase overall package reliability
Benefits
The benefits of this technology include:
- Better thermal management
- Enhanced electrical performance
- Improved overall package durability
Potential Commercial Applications
This technology could be commercially applied in:
- Data centers
- Automotive industry
- Consumer electronics
Possible Prior Art
One possible prior art for this technology could be:
- Existing semiconductor packaging techniques
- Previous methods for heat dissipation in electronic devices
Unanswered Questions
What materials are used in the heat dissipation member?
The patent application does not specify the materials used in the heat dissipation member. Further research or examination of the full patent document may provide more details on this aspect.
How does the encapsulant affect the overall performance of the semiconductor package?
The abstract mentions the encapsulant, but it does not delve into how it impacts the performance of the semiconductor package. Further investigation or analysis of the full patent application may shed light on this aspect.
Original Abstract Submitted
A semiconductor package includes a first redistribution structure, a first semiconductor chip disposed on an upper surface of the first redistribution structure, an encapsulant disposed between the first redistribution structure and the first semiconductor chip, a plurality of first conductive posts electrically connecting the first redistribution structure and the first semiconductor chip with each other, and penetrating through the encapsulant in a first direction, a heat dissipation member having at least a portion that overlaps the first semiconductor chip in a second direction that is perpendicular to the first direction, and a second semiconductor chip disposed between the first redistribution structure and the heat dissipation member, and encapsulated by the encapsulant. The first semiconductor chip overlaps the plurality of first conductive posts in the first direction. The first semiconductor chip does not overlap the second semiconductor chip in the first direction.
