18204717. APPARATUS FOR BONDING WIRE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
APPARATUS FOR BONDING WIRE
Organization Name
Inventor(s)
APPARATUS FOR BONDING WIRE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18204717 titled 'APPARATUS FOR BONDING WIRE
Simplified Explanation
The abstract describes a wire bonding apparatus that consists of a bonding stage, a capillary, a rotatable clamp with the capillary installed on it, and a bonding arm. The clamp has a housing with an internal space, a first member fixed at the upper end of the housing with a first gear unit, a second member fixed at the lower end of the housing with a second gear unit, and a third member with a third gear unit corresponding to the first gear unit and a fourth gear unit corresponding to the second gear unit. The capillary is fixed on the third member and rotates together with it.
- The apparatus includes a bonding stage, capillary, clamp, and bonding arm.
- The clamp is rotatably installed on the apparatus and has a housing with an internal space.
- A first member with a first gear unit is fixed at the upper end of the housing.
- A second member is fixed at the lower end of the housing and spaced apart from the first member.
- A third member is provided with a third gear unit corresponding to the first gear unit and a fourth gear unit corresponding to the second gear unit.
- The capillary is fixed on the third member and rotates with it.
Potential applications of this technology:
- Wire bonding in semiconductor manufacturing.
- Electrical connections in electronic devices.
- Assembly of microelectromechanical systems (MEMS).
- Packaging of integrated circuits.
Problems solved by this technology:
- Enables precise and controlled rotation of the capillary during wire bonding.
- Facilitates accurate positioning and alignment of the capillary.
- Improves the efficiency and reliability of wire bonding processes.
- Reduces the risk of damage to delicate components.
Benefits of this technology:
- Enhanced precision and control in wire bonding operations.
- Increased productivity and throughput in manufacturing processes.
- Improved quality and reliability of wire bonds.
- Reduced risk of errors and damage during wire bonding.
- Cost savings through improved efficiency and yield.
Original Abstract Submitted
A wire bonding apparatus includes a bonding stage, a capillary, a clamp provided with the capillary rotatably installed thereon, and a bonding arm. The clamp includes a housing having an internal space, a first member fixedly installed at an upper end of the internal space of the housing and provided with a first gear unit on a lower surface thereof, a second member fixedly installed at a lower end of the internal space of the housing to be spaced apart from the first member, and provided with a second gear unit on an upper surface thereof, a third member, the third member being provided with a third gear unit corresponding to the first gear unit and a fourth gear unit corresponding to the second gear unit, . The capillary is fixedly installed on the third member and rotates in conjunction with the third member.
