18204717. APPARATUS FOR BONDING WIRE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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APPARATUS FOR BONDING WIRE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Daewoong Heo of Suwon-si (KR)

APPARATUS FOR BONDING WIRE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18204717 titled 'APPARATUS FOR BONDING WIRE

Simplified Explanation

The abstract describes a wire bonding apparatus that consists of a bonding stage, a capillary, a rotatable clamp with the capillary installed on it, and a bonding arm. The clamp has a housing with an internal space, a first member fixed at the upper end of the housing with a first gear unit, a second member fixed at the lower end of the housing with a second gear unit, and a third member with a third gear unit corresponding to the first gear unit and a fourth gear unit corresponding to the second gear unit. The capillary is fixed on the third member and rotates together with it.

  • The apparatus includes a bonding stage, capillary, clamp, and bonding arm.
  • The clamp is rotatably installed on the apparatus and has a housing with an internal space.
  • A first member with a first gear unit is fixed at the upper end of the housing.
  • A second member is fixed at the lower end of the housing and spaced apart from the first member.
  • A third member is provided with a third gear unit corresponding to the first gear unit and a fourth gear unit corresponding to the second gear unit.
  • The capillary is fixed on the third member and rotates with it.

Potential applications of this technology:

  • Wire bonding in semiconductor manufacturing.
  • Electrical connections in electronic devices.
  • Assembly of microelectromechanical systems (MEMS).
  • Packaging of integrated circuits.

Problems solved by this technology:

  • Enables precise and controlled rotation of the capillary during wire bonding.
  • Facilitates accurate positioning and alignment of the capillary.
  • Improves the efficiency and reliability of wire bonding processes.
  • Reduces the risk of damage to delicate components.

Benefits of this technology:

  • Enhanced precision and control in wire bonding operations.
  • Increased productivity and throughput in manufacturing processes.
  • Improved quality and reliability of wire bonds.
  • Reduced risk of errors and damage during wire bonding.
  • Cost savings through improved efficiency and yield.


Original Abstract Submitted

A wire bonding apparatus includes a bonding stage, a capillary, a clamp provided with the capillary rotatably installed thereon, and a bonding arm. The clamp includes a housing having an internal space, a first member fixedly installed at an upper end of the internal space of the housing and provided with a first gear unit on a lower surface thereof, a second member fixedly installed at a lower end of the internal space of the housing to be spaced apart from the first member, and provided with a second gear unit on an upper surface thereof, a third member, the third member being provided with a third gear unit corresponding to the first gear unit and a fourth gear unit corresponding to the second gear unit, . The capillary is fixedly installed on the third member and rotates in conjunction with the third member.