18204695. ELECTRONIC DEVICE INCLUDING HOUSING HAVING DISSIMILAR METALS simplified abstract (Samsung Electronics Co., Ltd.)

ELECTRONIC DEVICE INCLUDING HOUSING HAVING DISSIMILAR METALS

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Sungduck Park of Suwon-si (KR)

Kwondeuk Yoon of Suwon-si (KR)

Kitae Park of Suwon-si (KR)

Yunho Son of Suwon-si (KR)

Jaehoon Yoon of Suwon-si (KR)

Cheolwoong Yoon of Suwon-si (KR)

Youngsoo Kim of Suwon-si (KR)

Kidoc Son of Suwon-si (KR)

Hyunsuk Choi of Suwon-si (KR)

Yongduk Kwon of Suwon-si (KR)

Jongbo Kim of Suwon-si (KR)

ELECTRONIC DEVICE INCLUDING HOUSING HAVING DISSIMILAR METALS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18204695 titled 'ELECTRONIC DEVICE INCLUDING HOUSING HAVING DISSIMILAR METALS

Simplified Explanation

The abstract describes an electronic device that includes a side bezel structure with a first body surrounding the inner space of the device and a second body extending from the first body into the inner space, which has a through hole. The device also includes a plate with a support portion within the inner space and a protrusion portion extending from the support portion into the through hole. The protrusion portion is coupled to the second body and corresponds to the through hole. A conductive adhesive member is used to couple the through hole and the protrusion portion.

• The electronic device has a side bezel structure with a first body and a second body that extends into the inner space.
• The second body has a through hole, and a plate with a support portion is present within the inner space.
• A protrusion portion extends from the support portion into the through hole and is coupled to the second body.
• A conductive adhesive member is used to connect the through hole and the protrusion portion.

Potential applications of this technology:

• This technology can be used in the manufacturing of electronic devices such as smartphones, tablets, or laptops.
• It can improve the structural integrity of the device by providing a secure connection between the side bezel structure and the plate.
• The conductive adhesive member can also help in grounding or electrical connections within the device.

Problems solved by this technology:

• The technology solves the problem of securing the side bezel structure to the plate within the electronic device.
• It ensures a reliable and durable connection between the components, reducing the risk of detachment or damage.

Benefits of this technology:

• The use of the protrusion portion and conductive adhesive member provides a strong and stable connection between the side bezel structure and the plate.
• This technology improves the overall structural integrity of the electronic device, enhancing its durability and reliability.
• It can also simplify the manufacturing process by providing an efficient method of connecting the components.

Original Abstract Submitted

An electronic device includes: a side bezel structure including a first body surrounding an inner space of the device, and a second body extending from the first body into the inner space and including a through hole; a plate including a support portion within the inner space; a protrusion portion extending from the support portion into the through hole, the protrusion portion being coupling to the second body and corresponding to the through hole; and a conductive adhesive member coupling the through hole and the protrusion portion, which is disposed between the through hole and the protrusion portion. An area of the protrusion portion contacting one surface of the second body toward the support portion is narrower than an area of the protrusion portion contacting another surface of the second body.