18203138. SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD
Organization Name
Inventor(s)
JONGCHEON Sun of SUWON-SI (KR)
HYEONGCHEOL Lee of SUWON-SI (KR)
SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18203138 titled 'SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD
Simplified Explanation
The patent application describes a method for inspecting a substrate by modeling the electric circuit of internal wires, obtaining measured capacitance and resistance values, calculating impedance values, and comparing them with the circuit model to determine substrate reliability.
- Substrate inspection method:
- Substrate with internal wires and connection wires - Internal wires between insulating layers, connection wires extending from internal wires - Circuit model generated from electric circuit of internal wires - Measured capacitance values obtained through AC power - Measured resistance values obtained through DC power - Impedance values calculated from measured capacitance and resistance values - Comparison of impedance values and circuit model to determine substrate reliability
Potential Applications
The technology can be applied in: - Quality control of electronic components - Fault detection in circuit boards - Testing of integrated circuits
Problems Solved
This technology addresses: - Ensuring reliability of substrates - Identifying defects in internal wiring - Improving overall performance of electronic devices
Benefits
The benefits of this technology include: - Enhanced quality control processes - Increased efficiency in substrate inspection - Reduction in manufacturing defects
Potential Commercial Applications
"Substrate Inspection Method for Enhanced Quality Control and Reliability Assessment"
Possible Prior Art
There may be prior art related to: - Circuit modeling for substrate inspection - Impedance calculation in electronic components
Unanswered Questions
How does this method compare to traditional substrate inspection techniques?
This method offers a more comprehensive approach by combining capacitance and resistance measurements to calculate impedance values, providing a more accurate assessment of substrate reliability.
What are the limitations of this technology in terms of substrate size and complexity?
The technology may face challenges when inspecting substrates with a high number of internal wires or complex circuit designs, as it may require more advanced modeling and measurement techniques.
Original Abstract Submitted
In a substrate inspection method, a substrate is provided on a substrate stage, the substrate having internal wires and connection wires, the internal wires respectively provided between stacked insulating layers, the connection wires respectively extending from the internal wires and exposed to an upper surface of the substrate. An electric circuit of the internal wires in the substrate is modeled to generate a circuit model. AC power is applied to the substrate stage to obtain measured capacitance values of the internal wires through currents that are obtained from the connection wires. DC power is applied to the substrate stage to obtain measured resistance values of the internal wires through voltages that are obtained from the connection wires. Impedance values of the internal wires are calculated through the measured capacitance values and the measured resistance values. The impedance values and the circuit model are compared to determine reliability of the substrate.
